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Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Sony Group Corp.International Business Machines Corp.Fujitsu Ltd.General Electric Co.General Electric Co.Seiko Epson Corp.SANYO Electric Co., Ltd.Intel Corp.ZTE Corp.Apple, Inc.FUJIFILM Corp.Hewlett-Packard Development Co.Eastman Kodak Co.Fujifilm Business Innovation Corp.Google LLCFujifilm Business Innovation Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Honeywell International, Inc.Xerox Holdings Corp.Tencent Technology (Shenzhen) Co., Ltd.Alcatel-Lucent S AOlympus Corp.Microsoft Corp.Beijing Xiaomi Mobile Software Co., Ltd.Toyota Industries Corp.Muratec Automation Co., Ltd.
GroundProbe Pty Ltd.
NIPPON STEEL Stainless Steel Corp.Kobe Steel, Ltd.JFE Steel Corp.NKK Corp.NKK Corp.Idemitsu Kosan Co., Ltd.JX Nippon Mining & Metals Corp.Mitsui Mining & Smelting Co., Ltd.Baoshan Iron & Steel Co., Ltd.Baoshan Iron & Steel Co., Ltd.NIPPON STEEL Stainless Steel Corp.JSWNippon Light Metal Co., Ltd.Kennametal, Inc.Angang Steel Co., Ltd.Xi'an University of Science & TechnologyTanaka Kikinzoku Kogyo KKTanaka Holdings Co. Ltd.Sankyo Aluminum Industry Co., Ltd.Arconic, Inc.Arconic, Inc.Showa Aluminum Corp.Jinchuan Group Co., Ltd.Global Tungsten & Powders Corp.Armstrong Ceiling Solutions (Australia) Pty Ltd.Wuhan Iron & Steel Co., Ltd.Dowa Electronics Materials Co., Ltd.Sandvik AktiebolagToyo Kohan Co., Ltd.thyssenkrupp Steel Europe AG