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Samsung Electronics Co., Ltd.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Toppan, Inc.Samsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.South China University of TechnologySoutheast University
Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.Ehwa Diamond Industrial Co., Ltd.Furuya Metal Co., Ltd.Funik Ultrahard Material Co., Ltd.Rolls-Royce High Temperature Composites, Inc.Diamond Productions, Inc.Changshu Wanke Precision Tools Co., Ltd.NanJing Sanchao Advanced Materials Co., Ltd.NanJing Sanchao Advanced Materials Co., Ltd.Changshu Wanke Precision Tools Co., Ltd.Feedback Technology Corp.Weihai Weiying Tool Co., Ltd.Seram Coatings ASSandvik Hyperion ABKennametal Sintec Keramik GmbHGünter Effgen GmbH
Selig Sealing Products, Inc.NexGen Power Systems, Inc.Brivo Systems LLCTYAN Computer Corp.Kieback & Peter GmbH & Co. KG