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Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.Hon Hai Precision Industry Co., Ltd.Samsung Display Co., Ltd.SK hynix, Inc.BOE Technology Group Co., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Boe Innovation Investment Co. Ltd.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.LG Display Co., Ltd.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Oki Electric Industry Co., Ltd.Applied Materials, Inc.Micron Technology, Inc.Fraunhofer-Gesellschaft eVShin-Etsu Chemical Co., Ltd.TOPPAN Holdings, Inc.Guangzhou Bosma Optoelectronic Technology Co. Ltd.
Taiwan Semiconductor Manufacturing Co., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Nordson Corp.Shinko Electric Industries Co., Ltd.Shinko Electric Industries Co., Ltd.Advanced Semiconductor Engineering, Inc.Tokyo Seimitsu Co., Ltd.MKS Instruments, Inc.Siliconware Precision Industries Co., Ltd.Unimicron Technology Corp.STATS ChipPAC Pte Ltd.FormFactor, Inc.Namics Corp.Powertech Technology, Inc.JCET Group Co., Ltd.AT & S Austria Technologie & Systemtechnik AGMPI Corp.Xintec, Inc.JAPAN ELECTRONIC MATERIALS CORP.JAPAN ELECTRONIC MATERIALS CORP.HANMI Semiconductor Co., Ltd.Chipbond Technology Corp.King Yuan Electronics Co., Ltd.Amkor Technology, Inc.SL Energy Co., Ltd.NEPES Corp.Subtron Technology Co., Ltd.Foshan Nationstar Semiconductor Co., Ltd.Lingsen Precision Industries Ltd.Kinsus Interconnect Technology Corp.
Phoenix Precision Technology Corp.Subtron Technology Co., Ltd.Kinsus Interconnect Technology Corp.Micro Contact Solution Co., Ltd.Applied Microtech SAX-Scan Imaging Corp.Vanguard Automation, Inc.
Fraunhofer-Gesellschaft eVShinko Electric Industries Co., Ltd.Shinko Electric Industries Co., Ltd.Winbond Electronics Corp.Advanced Semiconductor Engineering, Inc.Arizona State UniversitySiliconware Precision Industries Co., Ltd.Qimonda AGPower Integrations, Inc.International Rectifier Corp.Unimicron Technology Corp.STATS ChipPAC Pte Ltd.The University of SheffieldNuvoton Technology Corp.Dowa Electronics Materials Co., Ltd.Powertech Technology, Inc.eMemory Technology, Inc.JCET Group Co., Ltd.University of South CarolinaMentor Graphics Corp.Xintec, Inc.Etron Technology, Inc.Chipbond Technology Corp.King Yuan Electronics Co., Ltd.Shenzhen Sunlord Electronics Co., Ltd.Amkor Technology, Inc.Princo Corp.NEPES Corp.Camtek Ltd.Xiamen San'an Integrated Circuit Co., Ltd.
American Can Co.American Can Co.Shinko Electric Industries Co., Ltd.Shinko Electric Industries Co., Ltd.Owens-Brockway Glass Container, Inc.Graphic Packaging International LLCShibuya Corp.Toyo Seikan Group Holdings Ltd.Daiwa Can Co., Ltd.CROWN Packaging Technology, Inc.Mauser-Werke GmbHMeadWestvaco Corp.FP Corp.Fuji Seal International, Inc.ADAMA Makhteshim Ltd.The United States Postal ServicePlastipak Packaging, Inc.Yonwoo Co., Ltd.Hosokawa Yoko Co. Ltd.Saint-Gobain Glass France SASRanpak Corp.Mitsui Chemicals Tohcello, Inc.Mauser Corp.Precision Valve Corp.Toyo Glass Co., Ltd.Sealed Air Corp. (US)Rengo Co., Ltd.ALTEMIRA Co., Ltd.Crown Cork & Seal Co., Inc.Aptar Radolfzell GmbH
Taiwan Semiconductor Manufacturing Co., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Applied Materials, Inc.Samsung Electro-Mechanics Co., Ltd.United Microelectronics Corp.Shinko Electric Industries Co., Ltd.Shinko Electric Industries Co., Ltd.Fujitsu Semiconductor Ltd.Advanced Semiconductor Engineering, Inc.Siliconware Precision Industries Co., Ltd.Qimonda AGUnimicron Technology Corp.STATS ChipPAC Pte Ltd.Adeia Semiconductor Technologies LLCPowertech Technology, Inc.JCET Group Co., Ltd.AT & S Austria Technologie & Systemtechnik AGXintec, Inc.Chipbond Technology Corp.King Yuan Electronics Co., Ltd.Amkor Technology, Inc.NEPES Corp.Camtek Ltd.Advanced Chip Engineering Technology, Inc.Niko Semiconductor Co., Ltd.Samsung Semiconductor, Inc.3D Plus SASX Display Co. Technology Ltd.Tianshui Huatian Technology Co., Ltd.Tianshui Huatian Technology Co., Ltd.
Fujitsu Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.South China University of TechnologyMediaTek, Inc.KIOXIA Corp.United Microelectronics Corp.Nanjing University of Posts & TelecommunicationsSocionext, Inc.Shinko Electric Industries Co., Ltd.Shinko Electric Industries Co., Ltd.Fujitsu Semiconductor Ltd.DB HITEK Co., Ltd.Advanced Semiconductor Engineering, Inc.EPISTAR Corp.Novatek Microelectronics Corp.Rambus, Inc.HRL Laboratories LLCNational Tsing-Hua UniversityCanon Anelva Corp.Siliconware Precision Industries Co., Ltd.Power Integrations, Inc.International Rectifier Corp.STATS ChipPAC Pte Ltd.Nagoya Institute of TechnologyABLIC, Inc.Nuvoton Technology Corp.Dowa Electronics Materials Co., Ltd.National Sun Yat-Sen UniversityPowertech Technology, Inc.