ShopifyRedditTik tokAppleSquarespaceSoundcloudMediumParallelsZoomGoogleGodaddyMicrosoftForbesEtsyHuawei TechnologiesYandexAmazonEvent briteDribbbleHatenaWalmartWPengineUberSplunkServiceNowTwilioHubSpotMuleSoftBloombergCargill
International Business Machines Corp.Dow Global Technologies LLCMicrosoft Corp.Hewlett Packard Enterprise Development LPBoston Scientific Scimed, Inc.Baidu Online Network Technology (Beijing) Co., Ltd.NCR Corp.Orion Co., Ltd.Citrix Systems, Inc.NetEase (Hangzhou) Network Co., Ltd.Avaya, Inc.Heroku, Inc.Alcatel-Lucent Shanghai Bell Co., Ltd.Beijing Gridsum Technology Co., Ltd.Beijing Gridsum Technology Co., Ltd.ServiceNow, Inc.NTT DATA Corp.Baidu USA LLCMegvii (Beijing) Technology Co., Ltd.NTT Communications Corp.United Video Properties, Inc.Genesys Cloud Services, Inc.Xing, Inc.Alibaba Cloud Computing Ltd.Akamai Technologies, Inc.Guangzhou Huaduo Network Technology Co., Ltd.Ikegami Tsushinki Co., Ltd.Guangzhou Huaduo Network Technology Co., Ltd.Infosys Ltd.Metrologic Instruments, Inc.
International Business Machines Corp.Fujitsu Ltd.Eastman Kodak Co.Google LLCMicrosoft Corp.Beijing Xiaomi Mobile Software Co., Ltd.Beijing Xiaomi Mobile Software Co., Ltd.Baidu Online Network Technology (Beijing) Co., Ltd.BlackBerry Ltd.Deutsche Telekom AGDeutsche Telekom AGGemalto, Inc.Sega Group Corp.Beijing Jingdong Shangke Information Technology Co., Ltd.Beijing Jingdong Shangke Information Technology Co., Ltd.Orion Co., Ltd.LEGO A/SLEGO A/SNetEase (Hangzhou) Network Co., Ltd.Altera Corp.SK Planet Co., Ltd.Avaya, Inc.HGST, Inc.Heroku, Inc.Alcatel-Lucent Shanghai Bell Co., Ltd.Sandvik AktiebolagOlivetti SpASaudi Basic Industries Corp.CA Technologies, Inc.Hitachi Advanced Digital, Inc.
International Business Machines Corp.Microsoft Corp.Baidu Online Network Technology (Beijing) Co., Ltd.BlackBerry Ltd.Wistron Corp.Orange SAOrion Co., Ltd.Tata Consultancy Services Ltd.NetEase (Hangzhou) Network Co., Ltd.Hitachi Software Engineering Co., Ltd.Hitachi Software Engineering Co., Ltd.Heroku, Inc.Alcatel-Lucent Shanghai Bell Co., Ltd.NAVER Corp.NEC Soft Ltd.ThyssenKrupp Presta AGBeijing Gridsum Technology Co., Ltd.Beijing Gridsum Technology Co., Ltd.Mosaid Technologies, Inc.Power Integrations, Inc.TRUMPF Werkzeugmaschinen GmbH + Co. KGBaidu USA LLCAsahi Techno Co., Ltd.Megvii (Beijing) Technology Co., Ltd.Intel Deutschland GmbHUnited Video Properties, Inc.Miracle Automation Engineering Co., Ltd.Miracle Automation Engineering Co., Ltd.Xing, Inc.Hangzhou Hikvision System Technology Co., Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.International Business Machines Corp.Fujitsu Ltd.General Electric Co.Huawei Technologies Co., Ltd.Seiko Epson Corp.SANYO Electric Co., Ltd.Intel Corp.ZTE Corp.Apple, Inc.FUJIFILM Corp.Hewlett-Packard Development Co.Eastman Kodak Co.Fujifilm Business Innovation Corp.Google LLCFujifilm Business Innovation Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Honeywell International, Inc.Xerox Holdings Corp.Tencent Technology (Shenzhen) Co., Ltd.Alcatel-Lucent S AOlympus Corp.Microsoft Corp.Beijing Xiaomi Mobile Software Co., Ltd.Toyota Industries Corp.Muratec Automation Co., Ltd.Victor Company of Japan Ltd.Victor Company of Japan Ltd.
Nippon Telegraph & Telephone Corp.Lucent Technologies, Inc.Xiaomi Corp.Douyin Vision (Beijing) Co., Ltd.SCA Hygiene Products ABTaiheiyo Cement Corp.Hitachi Software Engineering Co., Ltd.Hitachi Software Engineering Co., Ltd.Beijing Didi Infinity Technology & Development Co., Ltd.Beijing Didi Infinity Technology & Development Co., Ltd.IBM United Kingdom Ltd.NetApp, Inc.Olivetti SpANCR International, Inc.PGS Geophysical ASNetwork Appliance, Inc.Nippon Avionics Co., Ltd.First Data Corp.Veritas Technologies LLCNicira, Inc.Herakles LLCTA TRIUMPH-ADLER AGMetrologic Instruments, Inc.Macrovision Corp.Electronic Data Systems Corp.Conduent Business Services LLCShenzhen Suteng Innovation Technology Co., Ltd.ION Geophysical Corp.ASK SANEC (China) Co., Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Sumitomo Metal Industries Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.TCL China Star Optoelectronics Technology Co., Ltd.NXP Semiconductors (Thailand) Co., Ltd.NGK SPARK PLUG CO., LTD.NXP BVTCL China Star Optoelectronics Technology Co., Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Toppan, Inc.Samsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.South China University of TechnologySoutheast University