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Samsung Electronics Co., Ltd.International Business Machines Corp.Apple, Inc.Micron Technology, Inc.NTT DOCOMO, Inc.South China University of TechnologyMicrosoft Corp.Industrial Technology Research InstituteShanghai Jiao Tong UniversityZhejiang University of TechnologyHarbin Institute of TechnologyInventec Corp.University of Electronic Science & Technology of ChinaBeihang UniversityKunming University of Science & TechnologyMediaTek, Inc.Dalian University of TechnologyAdvanced Micro Devices, Inc.Wuhan UniversityTongji UniversityBeijing Institute of TechnologyMinolta Co., Ltd.Meta Platforms, Inc.Zhejiang Sci-Tech UniversitySouthwest Jiaotong UniversityFuzhou UniversityHarbin University of Science & TechnologySK Telecom Co., Ltd.Wisconsin Alumni Research FoundationHangzhou Dianzi University
L3Harris Technologies ASA Ltd.GCT Semiconductor, Inc.Grass Valley LtdFio Corp.CardinalCommerce Corp.Sybase 365 LLCINFINITT Healthcare Co., Ltd.ShareWave, Inc.INKA Entworks, Inc.Grandstream Networks, Inc.Von Braun Center for Science & Innovation, Inc.Acme Packet, Inc.Synapse Wireless, Inc.Hyulim Networks Co., Ltd.Pexip ASFachhochschule Technikum WienMobile 365, Inc.Mobile 365, Inc.LightSurf Technologies, Inc.Twisted Pair Solutions, Inc.NextPlane, Inc.Enli Health Intelligence Corp.Geotoll, Inc.Rimini Street, Inc.Iotic Labs LtdNovelSat Ltd.ModoPayments LLCGreen Dot Corp.Vossloh Locomotives GmbHAdvanced Ground Information Systems, Inc.