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ASM NEXX, Inc.Highlight Tech System Corp.XEI Scientific, Inc.
Samsung Electronics Co., Ltd.LG Electronics, Inc.General Electric Co.Sharp Corp.Seiko Epson Corp.SANYO Electric Co., Ltd.E.I. du Pont de Nemours & Co.EIDP, Inc.Intel Corp.Sumitomo Electric Industries Ltd.Apple, Inc.Brother Industries, Ltd.KYOCERA Chemical Corp.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Toshiba Chemical Corp.Fujifilm Business Innovation Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Daewoo Electronics Co. Ltd.DAIKIN INDUSTRIES Ltd.Honeywell International, Inc.Nitto Electric Industrial Co. Ltd.Kobe Steel, Ltd.Casio Computer Co., Ltd.Midea Group Co. Ltd.
Sumitomo Heavy Industries, Ltd.Forschungszentrum Jülich GmbHTaiyo Holdings Co., Ltd.Hypertherm Associates, Inc.Ecole PolytechniqueWONIK HOLDINGS CO., LTD.Koike Sanso Kogyo Co., Ltd.Haemonetics Corp.The Lincoln Electric Co.TOCALO Co., Ltd.VON ARDENNE GmbHThe ESAB Group, Inc.Yantai Longyuan Power Technology Co., Ltd.TAE Technologies, Inc.SPTS Technologies Ltd.Université de LimogesLG Electronics (Nanjing) Plasma Co. Ltd.Tokamak Energy Ltd.P2i Ltd.NEW POWER PLASMA Co., Ltd.Ceravision Ltd.LFB Biotechnologies SASUAlenia Aermacchi SpAJCU Corp.TRUMPF Hüttinger GmbH + Co. KGSilicon Genesis Corp.Charm Engineering Co., Ltd.DAWONSYS Co., Ltd.SAMCO, Inc.Tekna Plasma Systems, Inc.