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Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Oki Electric Industry Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Micron Technology, Inc.Toppan, Inc.Fraunhofer-Gesellschaft eVSamsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.
Yamaha Corporation of AmericaTopcon Corp.GoerTek Inc.Japan Radio Co. Ltd.Onkyo Home Entertainment Corp.Quantum SpAShenzhen Skyworth Digital Technology Co., Ltd.Shenzhen Skyworth Digital Technology Co., Ltd.Shenzhen Coship Electronics Co., Ltd.DX Antenna Co., Ltd.EM-Tech. Co., Ltd.iBiquity Digital Corp.D&M Holdings, Inc.Shanghai Huace Navigation Technology Ltd.Hirschmann Car Communication GmbHDURA Automotive Systems, Inc.INKEL Corp.EnOcean GmbHZoran Corp.Powercast Corp.Hi-Target Surveying Instrument Co. Ltd.Lumentum Technology UK Ltd.Trevi SpACooper-Standard Automotive, Inc.Sullair LLCHoly Stone Enterprise Co., Ltd.Holy Stone Enterprise Co., Ltd.Valens Semiconductor Ltd.IC Plus Corp.Beyond Gravity Schweiz AG