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Tokyo Seimitsu Co., Ltd.Ando Electric Co., Ltd.ONO SOKKI Co., Ltd.Nidec-Shimpo Corp.i-SENS, Inc.Guangdong Transtek Medical Electronics Co., Ltd.Guangdong Transtek Medical Electronics Co., Ltd.Harbin Measuring & Cutting Tool Group Co., Ltd.Harbin Measuring & Cutting Tool Group Co., Ltd.Kosaka Laboratory Ltd.Omnisystem Co., Ltd.Nanjing Glarun-Atten Technology Co., Ltd.DASAN RND Co., Ltd.MiCo BioMed Co. Ltd.Beijing Information Technology InstituteBeijing Information Technology InstituteBopp & Reuther Messtechnik GmbHZfx GmbHEMIC Corp.Nidec-Read (Zhejiang) Corp.Hota Industrial Manufacturing Co., Ltd.Nishikawa Keisoku Co., Ltd.Hota Industrial Manufacturing Co., Ltd.Safetool SASXiaogan Song-Lin Kokusai Measuring Instrument Co., Ltd.UWT GmbHEnvic-Sense ABFuji Glass Co., Ltd.Nanjing Xinlian Telecommunication Instrument Co. Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.LG Electronics, Inc.Fujitsu Ltd.Sharp Corp.Ricoh Co., Ltd.Seiko Epson Corp.SANYO Electric Co., Ltd.Intel Corp.FUJIFILM Corp.Apple, Inc.ZTE Corp.Hon Hai Precision Industry Co., Ltd.Samsung Display Co., Ltd.SK hynix, Inc.BOE Technology Group Co., Ltd.Hewlett-Packard Development Co.Brother Industries, Ltd.Eastman Kodak Co.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Boe Innovation Investment Co. Ltd.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.LG Display Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Xerox Holdings Corp.Oki Electric Industry Co., Ltd.Olympus Corp.
Samsung Electronics Co., Ltd.LG Electronics, Inc.General Electric Co.General Electric Co.Sharp Corp.Seiko Epson Corp.SANYO Electric Co., Ltd.E.I. du Pont de Nemours & Co.Intel Corp.Sumitomo Electric Industries Ltd.Apple, Inc.Sumitomo Electric Industries Ltd.Hon Hai Precision Industry Co., Ltd.SK hynix, Inc.Brother Industries, Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Toshiba Chemical Corp.Fuji Electronics Co., Ltd.LG Display Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Daewoo Electronics Co. Ltd.DAIKIN INDUSTRIES Ltd.Honeywell International, Inc.Kobe Steel, Ltd.
Applied Materials, Inc.SCREEN Holdings Co., Ltd.Lam Research Corp.ULVAC, Inc.Hansgrohe SEVarian Semiconductor Equipment Associates, Inc.Canon Anelva Corp.JUSUNG ENGINEERING Co., Ltd.Novellus Systems, Inc.Advanced Micro Fabrication Equipment, Inc. ChinaH.C. Starck, Inc.AIXTRON SEAdvanced Micro Fabrication Equipment, Inc. ChinaPraxair S.T. Technology, Inc.Moen, Inc.Brewer Science, Inc.Mattson Technology, Inc.TOCALO Co., Ltd.Toray Advanced Film Co., Ltd.Intevac, Inc.HEF SASUltraTech International, Inc.A.W. Chesterton Co.Howmet Ltd.P2i Ltd.Evatec AGPicosun OyA&A Material Corp.Eutectic Corp.Hemoteq AG
Applied Materials, Inc.SCREEN Holdings Co., Ltd.Lam Research Corp.Mitsubishi Paper Mills Ltd.ULVAC, Inc.NOF Corp.Varian Semiconductor Equipment Associates, Inc.Canon Anelva Corp.JUSUNG ENGINEERING Co., Ltd.Novellus Systems, Inc.Advanced Micro Fabrication Equipment, Inc. ChinaAIXTRON SEAdvanced Micro Fabrication Equipment, Inc. ChinaPraxair S.T. Technology, Inc.Mirae Corp.Kateeva, Inc.WONIK HOLDINGS CO., LTD.Brewer Science, Inc.Mattson Technology, Inc.GigaLane Co., Ltd.TOCALO Co., Ltd.VON ARDENNE GmbHToray Advanced Film Co., Ltd.Intevac, Inc.Beneq Group OyEugene Technology Co., Ltd.UltraTech International, Inc.HANMI Semiconductor Co., Ltd.SPTS Technologies Ltd.Howmet Ltd.
Alps Alpine Co., Ltd.Niterra Co., Ltd.OSRAM Opto Semiconductors GmbHFreescale Semiconductor, Inc.DePuy Synthes Products, Inc.TDK Electronics AGKeihin Corp.Conti Temic Microelectronic GmbHAsahi Kasei Microdevices Corp.Tamagawa Seiki Co., Ltd.STMicroelectronics International NVCTS Corp.Crane LLCDraeger Safety, Inc.Watlow Electric Manufacturing Co.Preh GmbHOPTEX Co. Ltd.Methode Electronics, Inc.Kistler Holding AGBorgWarner Ludwigsburg GmbHOVAL Corp.Nagano Keiki Co., Ltd.Interface, Inc.Casco Products Corp.FlexEnable Ltd.Shenzhen Suteng Innovation Technology Co., Ltd.FIGARO Engineering, Inc.Sensirion AGNippon Ceramic Co., Ltd.Tactual Labs Co.
Hon Hai Precision Industry Co., Ltd.SK hynix, Inc.Taiwan Semiconductor Manufacturing Co., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Applied Materials, Inc.South China University of TechnologySoutheast UniversityEbara Corp.SCREEN Holdings Co., Ltd.University of Electronic Science & Technology of ChinaLam Research Corp.DISCO Corp.Sony Semiconductor Solutions Corp.United Microelectronics Corp.Stanley Electric Co., Ltd.Semiconductor Components Industries LLCULVAC, Inc.Macronix International Co., Ltd.Socionext, Inc.TOKYO OHKA KOGYO CO., LTD.KLA Corp.Shinko Electric Industries Co., Ltd.Shinko Electric Industries Co., Ltd.National Semiconductor Corp.Fujitsu Semiconductor Ltd.Nanjing University of TechnologyWinbond Electronics Corp.Skyworks Solutions, Inc.DB HITEK Co., Ltd.