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Seiko Epson Corp.Nihon Dempa Kogyo Co., Ltd.Daishinku Corp.Kyocera Crystal Device Corp.TXC Corp.SUNNY ELECTRONICS Corp.École Nationale Supérieure de Mécanique et des MicrotechniqueInterquip Electronic Shenzhen Co. Ltd.Vectron International, Inc.Siward Crystal Technology Co., Ltd.Oscilloquartz SAH&S HighTech Corp.ZIPic OyHarmony Electronics Corp.SemiBlocks BVMobius Microsystems, Inc.Greenray Industries, Inc.Murata Electronics North America, Inc.Miyota Co., Ltd.Beijing Candor Electronic Co., Ltd.
Canon, Inc.Canon, Inc.Sony Group Corp.LG Electronics, Inc.International Business Machines Corp.Fujitsu Ltd.Sharp Corp.Ricoh Co., Ltd.Seiko Epson Corp.ZTE Corp.Apple, Inc.FUJIFILM Corp.BOE Technology Group Co., Ltd.Hewlett-Packard Development Co.Brother Industries, Ltd.Eastman Kodak Co.Boe Innovation Investment Co. Ltd.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fujifilm Business Innovation Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Xerox Holdings Corp.Semiconductor Energy Laboratory Co., Ltd.Mita Industrial Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Toppan, Inc.Konica Minolta, Inc.Renesas Electronics Corp.
Samsung Electronics Co., Ltd.LG Electronics, Inc.General Electric Co.General Electric Co.Sharp Corp.Seiko Epson Corp.SANYO Electric Co., Ltd.E.I. du Pont de Nemours & Co.EIDP, Inc.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.Apple, Inc.Brother Industries, Ltd.KYOCERA Chemical Corp.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Toshiba Chemical Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Daewoo Electronics Co. Ltd.DAIKIN INDUSTRIES Ltd.Honeywell International, Inc.Nitto Electric Industrial Co. Ltd.Kobe Steel, Ltd.Casio Computer Co., Ltd.Midea Group Co. Ltd.Mita Industrial Co., Ltd.
Nihon Dempa Kogyo Co., Ltd.Miyazaki Epson Corp.Nihon Plast Co., Ltd.CTS Corp.Daishinku Corp.Exelis, Inc.Sejung Co., Ltd.Montaplast GmbHSiTime Corp.Piezotech LLCTXC Corp.Midé Technology Corp.RIVER ELETEC CORP.École Nationale Supérieure de Mécanique et des MicrotechniqueInterquip Electronic Shenzhen Co. Ltd.Anjie Wireless Technology (Suzhou) Co., Ltd.Channel Products, Inc.Vectron International, Inc.PI Ceramic GmbHUmfotec GmbHCTS Ceramics Denmark A/SVesper Technologies, Inc.Chengdu Kingbri Frequency Technology Co. Ltd.Siward Crystal Technology Co., Ltd.Guangdong Failong Crystal Technology Co., LtdSawtek, Inc.Knowles Cazenovia, Inc.QorTek, Inc.Cedrat Technologies SAOxsensis Ltd.
Hitachi Ltd.General Electric Co.General Electric Co.State Grid Corp. of ChinaSumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.Honeywell International, Inc.Mitsubishi Motors Corp.Meidensha Corp.Osaka Gas Co., Ltd.Samsung Heavy Industries Co., Ltd.LSIS Co. Ltd.Tokyo Electric Power Co. Holdings, Inc.Nissin Electric Co., Ltd.State Grid Shanghai Municipal Electric Power Co.State Grid Shanghai Municipal Electric Power Co.Vestas Wind Systems A/STektronix, Inc.Korea Electric Power Corp.State Grid Hebei Electric Power Co.Hitachi Industrial Equipment Systems Co., Ltd.The Kansai Electric Power Co., Inc.Électricité de France SALear Corp.CGN Power Co., Ltd.Legrand SAHYOSUNG Corp.Nihon Dempa Kogyo Co., Ltd.Nexans SARittal GmbH & Co. KG