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SILTECTRA GmbHFlipChip International LLCPhoenix Silicon International Corp.Tru-Si Technologies, Inc.Tevel Aerobotics Technologies Ltd.Axus Technology, Inc.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Toppan, Inc.Fraunhofer-Gesellschaft eVSamsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.
KYOCERA Chemical Corp.The Dow Chemical Co.Mitsui Chemicals, Inc.Fraunhofer-Gesellschaft eVShowa Denko Materials Co. Ltd.Resonac Corp.Rohm & Haas Co.TOTO Ltd.DIC CorporationSumitomo Bakelite Co., Ltd.JSR Corp.W.R. Grace & Co.Nissan Chemical Corp.Ciba Specialty Chemicals Holding, Inc.Lam Research Corp.PPG Industries Ohio, Inc.Eastman Chemical Co.JX Nippon Mining & Metals Corp.Mitsubishi Paper Mills Ltd.JX Nippon Mining & Metals Corp.ULVAC, Inc.SCHOTT AGKansai Paint Co., Ltd.TOKYO OHKA KOGYO CO., LTD.NOF Corp.Nippon Paint Holdings Co., Ltd.Hon Hai Precision Industry Co., Ltd.Kennametal, Inc.Toyo Ink SC Holdings Co. Ltd.Angang Steel Co., Ltd.