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Rosemount, Inc.Tamagawa Seiki Co., Ltd.Draeger Safety, Inc.Preh GmbHBorgWarner Ludwigsburg GmbHNippon Ceramic Co., Ltd.I.G. Bauerhin GmbHSenseair ABSSI Technologies LLCOncque Corp.Exergen Corp.Custom Sensors & Technologies, Inc.ATI Industrial Automation, Inc.Zhejiang Dali Technology Co., Ltd.FiberCore, Inc.LAP GmbH Laser ApplikationenNew Imaging Technologies SASiLC Technologies, Inc.Integrated Sensing Systems, Inc.PLK Technologies Co., Ltd.RFMicron, Inc.Safran Sensing Technologies Switzerland SASilicon Microstructures, Inc.Contelec SARAE Systems, Inc.Gpixel, Inc.Anello Photonics, Inc.Raytek Corp.Smart Fibres Ltd.Silicon Sensing Systems Ltd.
Samsung Electronics Co., Ltd.LG Electronics, Inc.General Electric Co.Sharp Corp.Seiko Epson Corp.SANYO Electric Co., Ltd.E.I. du Pont de Nemours & Co.EIDP, Inc.Intel Corp.Sumitomo Electric Industries Ltd.Apple, Inc.Brother Industries, Ltd.KYOCERA Chemical Corp.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Toshiba Chemical Corp.Fujifilm Business Innovation Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Daewoo Electronics Co. Ltd.DAIKIN INDUSTRIES Ltd.Honeywell International, Inc.Kobe Steel, Ltd.Casio Computer Co., Ltd.Midea Group Co. Ltd.Electronics & Telecommunications Research Institute
Canon, Inc.Canon, Inc.Sony Group Corp.LG Electronics, Inc.International Business Machines Corp.Fujitsu Ltd.Sharp Corp.Ricoh Co., Ltd.Seiko Epson Corp.Intel Corp.ZTE Corp.Apple, Inc.FUJIFILM Corp.BOE Technology Group Co., Ltd.Hewlett-Packard Development Co.Brother Industries, Ltd.Eastman Kodak Co.Boe Innovation Investment Co. Ltd.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fujifilm Business Innovation Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Xerox Holdings Corp.Semiconductor Energy Laboratory Co., Ltd.Mita Industrial Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Toppan, Inc.Konica Minolta, Inc.
Shimadzu Corp.Spectra-Physics, Inc.HyperfinePhotonyx ASHolographix, Inc.Optometrics Corp.Headwall Photonics, Inc.American Holographic, Inc.
Boe Innovation Investment Co. Ltd.Honeywell International, Inc.Thales GroupAlps Alpine Co., Ltd.Raytheon Co.NGK SPARK PLUG CO., LTD.Hamamatsu Photonics KKJapan Aviation Electronics Industry Ltd.Nippon Seiki Co., Ltd.Freescale Semiconductor, Inc.LAPIS Semiconductor Co. Ltd.Analog Devices, Inc.DePuy Synthes Products, Inc.Dr. Johannes Heidenhain GmbHThe Georgia Tech Research Corp.Shenzhen Goodix Technology Co., Ltd.Shenzhen Goodix Technology Co., Ltd.Furuno Electric Co., Ltd.Novatek Microelectronics Corp.Textron, Inc.Asahi Kasei Microdevices Corp.Meizu Technology Co. Ltd.Tamagawa Seiki Co., Ltd.KEYENCE Corp.Weidmüller Interface GmbH & Co. KGFerranti Ltd.Piaggio & C SpAB/E Aerospace, Inc.Piaggio & C SpACooper Industries LLC
Pierian Biosciences LLCGnuBIO, Inc.ClearLight Biotechnologies LLC
Renishaw PlcSigma-Aldrich Co. Ltd.TeraView Ltd.Infraredx, Inc.Teem Photonics SAHyperMed Imaging, Inc.International Iberian Nanotechnology LaboratoryMetrohm AGOrSense Ltd.Kaiser Optical Systems, Inc.Zolix Instruments Co., Ltd.EDAX LLCLaVision GmbHDigilab, Inc.YIK Corp.VERTILAS GmbHGBC Scientific Equipment Pty Ltd.Bruker Optics, Inc.Gasporox ABTrinean NVOxxius SAAndor Technology Ltd.Optoplex Corp.Solus Technologies Ltd.TransTech Systems, Inc.ImagineOptix Corp.Photodigm, Inc.Protein Dynamics Solutions LLCSpectral Sciences, Inc.SPECS Surface Nano Analysis GmbH