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Samsung Electronics Co., Ltd.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Toppan, Inc.Samsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.South China University of Technology
Samsung Electronics Co., Ltd.Sony Group Corp.LG Electronics, Inc.General Electric Co.General Electric Co.Sharp Corp.Seiko Epson Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.Apple, Inc.Brother Industries, Ltd.KYOCERA Chemical Corp.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Toshiba Chemical Corp.Fujifilm Business Innovation Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Daewoo Electronics Co. Ltd.Honeywell International, Inc.Nitto Electric Industrial Co. Ltd.Kobe Steel, Ltd.Casio Computer Co., Ltd.Midea Group Co. Ltd.
ServiceNow, Inc.
LSI Corp.Colder Products Co.Paul Mueller Co.Peratech Holdco Ltd.Special Devices, Inc.Switchcraft, Inc.iC-Haus GmbHLeviatZetex PlcElma Electronic, Inc.Pillarhouse International Ltd.Marvell Hispania SLPressol - Schmiergerte GmbHSTAHL CraneSystems GmbHVascoMed GmbHAnTech Ltd.Hittite Microwave Corp.Powernet OyINSYS MICROELECTRONICS GmbHBrugger GmbHmicrofluidic ChipShop GmbHPoundfield Products Ltd.Guildline Instruments Ltd.Litronik Batterietechnologie GmbHHybricon Corp.Anaren, Inc.Frenzel GmbHTAS Energy, Inc.Accent SpAAkriform Plast AB
Huawei Technologies Co., Ltd.Intel Corp.Xerox Holdings Corp.Alcatel-Lucent S ANTT DOCOMO, Inc.Toshiba Lighting & Technology Corp.Toshiba Lighting & Technology Corp.MediaTek, Inc.Azbil Corp.SK Telecom Co., Ltd.BlackBerry Ltd.Sichuan Changhong Electric Co., Ltd.Sichuan Changhong Electric Co., Ltd.Orange SADeutsche Telekom AGHangzhou Hikvision Digital Technology Co., Ltd.Hangzhou Hikvision Digital Technology Co., Ltd.Zhejiang Dahua Technology Co. Ltd.Unisys Corp.Tata Consultancy Services Ltd.Legrand SAAtmel Corp.NARI Technology Co., Ltd.Shenyang Institute of AutomationTelecom Italia SpAFuji Electric Systems Co., Ltd.Comcast Cable Communications LLCT-Mobile USA, Inc.XJ Electric Co., Ltd.Sharkninja Operating LLC
Hitachi Ltd.LG Electronics, Inc.Toyota Motor Corp.International Business Machines Corp.Fujitsu Ltd.General Electric Co.Huawei Technologies Co., Ltd.Ericsson, Inc.Intel Corp.ZTE Corp.Apple, Inc.Boe Innovation Investment Co. Ltd.Google LLCHoneywell International, Inc.Xerox Holdings Corp.Bayerische Motoren Werke AGAlcatel-Lucent S ANTT DOCOMO, Inc.Renesas Electronics Corp.Dow Global Technologies LLCMicrosoft Corp.AUDI AGToshiba Lighting & Technology Corp.Toyoda Gosei Co., Ltd.Toshiba Lighting & Technology Corp.Hilti AGMediaTek, Inc.Aisin AW Co., Ltd.Boston Scientific Scimed, Inc.Advanced Micro Devices, Inc.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Sony Group Corp.Fujitsu Ltd.General Electric Co.General Electric Co.Huawei Technologies Co., Ltd.Seiko Epson Corp.SANYO Electric Co., Ltd.Intel Corp.Apple, Inc.FUJIFILM Corp.Hewlett-Packard Development Co.Eastman Kodak Co.Fujifilm Business Innovation Corp.Google LLCFujifilm Business Innovation Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Honeywell International, Inc.Xerox Holdings Corp.Oki Electric Industry Co., Ltd.Tencent Technology (Shenzhen) Co., Ltd.Alcatel-Lucent S AOlympus Corp.Microsoft Corp.Beijing Xiaomi Mobile Software Co., Ltd.Toyota Industries Corp.Muratec Automation Co., Ltd.