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Samsung Electronics Co., Ltd.LG Electronics, Inc.General Electric Co.Sharp Corp.Seiko Epson Corp.SANYO Electric Co., Ltd.E.I. du Pont de Nemours & Co.EIDP, Inc.Intel Corp.Sumitomo Electric Industries Ltd.Apple, Inc.Brother Industries, Ltd.KYOCERA Chemical Corp.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Toshiba Chemical Corp.Fujifilm Business Innovation Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Daewoo Electronics Co. Ltd.DAIKIN INDUSTRIES Ltd.Honeywell International, Inc.Nitto Electric Industrial Co. Ltd.Kobe Steel, Ltd.Casio Computer Co., Ltd.Midea Group Co. Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Sony Group Corp.LG Electronics, Inc.International Business Machines Corp.Fujitsu Ltd.Sharp Corp.Ricoh Co., Ltd.Ricoh Co., Ltd.Seiko Epson Corp.SANYO Electric Co., Ltd.ZTE Corp.Apple, Inc.FUJIFILM Corp.BOE Technology Group Co., Ltd.Hewlett-Packard Development Co.Brother Industries, Ltd.Eastman Kodak Co.Boe Innovation Investment Co. Ltd.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fujifilm Business Innovation Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Xerox Holdings Corp.Semiconductor Energy Laboratory Co., Ltd.Mita Industrial Co., Ltd.Toppan, Inc.
Allwinner Technology Co., Ltd.Harmonic, Inc.Hangzhou Arcvideo Technology Co., Ltd.NetPosa Technologies Ltd.Anhui Qingxin Internet Information Tochnology Co. Ltd.Shenzhen Lenkeng Technology Co., Ltd.Shenzhen Lenkeng Technology Co., Ltd.Apical Ltd.ARRIS Group, Inc.Nanjing Magewell Electronics Co., Ltd.Nanjing Magewell Electronics Co., Ltd.Dynacolor, Inc.Black Sesame Technologies (Shanghai) Co., Ltd.Global IP Solutions, Inc.Beijing Meishe Network Technology Co. Ltd.Beijing Meishe Network Technology Co. Ltd.FastVDO LLCCasa Systems, Inc.Sencore, Inc.Cognitech, Inc.Human Monitoring Ltd.Quartics, Inc.Elemental Technologies LLCVideotron Corp.Huaya Microelectronics, Inc.RemoteReality Corp.Envivio, Inc.Teranex, Inc.RiverSilica Technologies Pvt Ltd.Headplay, Inc.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Oki Electric Industry Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Micron Technology, Inc.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Resonac Corp.Sumitomo Metal Industries Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Toppan, Inc.Samsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.South China University of TechnologySoutheast UniversitySumitomo Metal Industries Ltd.
Jervis B. Webb Co.Shining 3D Tech Co., Ltd.GSI Technology, Inc.Galaxy Biotech LLCHarvest Technologies, Inc.CLO Virtual Fashion, Inc.Gallery Direct Ltd.Biamp Systems LLCLeviatFujian Aurine Technology Co. Ltd.Rex Industries, Inc.FIPA GmbHGunnebo Industrier ABMega Fluid Systems, Inc.Wade Ceramics Ltd.Tancia Ltd.Pacific Coast Composites, Inc.Magnomics SAExpograf Cardkeep International ABPreci-Spark Ltd.Advanced RF Technologies, Inc.System Trailers Fahrzeugbau GmbhImaginetics LLCPhase IV Engineering, Inc.William Say & Co. Ltd.Connectors Verbindungstechnik AGIsophon Glas GmbH
Hoeganaes Corp.3D Systems, Inc.Autodesk, Inc.FARO Technologies, Inc.Dassault Systèmes SAXYZprinting, Inc.Kuraray Noritake Dental, Inc.Stratasys Ltd.Nippon Carbon Co., Ltd.Esstech, Inc.DWS SrlBerco SpAMedit Corp.voxeljet AGConcept Laser GmbHSLM Solutions Group AGMetalysis Ltd.RIEGL Laser Measurement Systems GmbHEarlens Corp.CAXA Technology Co., Ltd.MarkForged, Inc.Formlabs, Inc.CMET, Inc.Shanghai Union Technology Co., Ltd.Shanghai Union Technology Co., Ltd.The ExOne Co.Dassault Systèmes SolidWorks Corp.Amann Girrbach AGZrapid Technologies Co., Ltd.Perceptron, Inc.
