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BOE Technology Group Co., Ltd.Fujifilm Business Innovation Corp.Fujifilm Business Innovation Corp.Fraunhofer-Gesellschaft eVTCL China Star Optoelectronics Technology Co., Ltd.TCL China Star Optoelectronics Technology Co., Ltd.Toshiba Lighting & Technology Corp.Toshiba Lighting & Technology Corp.LG Display Co., Ltd.Japan Display, Inc.Chunghwa Picture Tubes Ltd.Sumitomo Electric Hardmetal Ltd.JNC Corp.Universal Display Corp.Lumileds Holding BVBrewer Science, Inc.Genesis Photonics, Inc.MicroVision, Inc.Nanjing CEC-PANDA LCD Technology Co., Ltd.Nanjing CEC-PANDA LCD Technology Co., Ltd.Foshan NationStar Optoelectronics Co., Ltd.Nanosys, Inc.Foshan Nationstar Optoelectronics Co., Ltd.CEMEDINE Co., Ltd.Intematix Corp.Toray Advanced Film Co., Ltd.Beneq Group OyPlessey Semiconductors Ltd.UltraTech International, Inc.Navinfo Co., Ltd.
Canon, Inc.Ricoh Co., Ltd.Fujifilm Business Innovation Corp.Fujifilm Business Innovation Corp.Casio Computer Co., Ltd.Fraunhofer-Gesellschaft eVOlympus Corp.Daihatsu Motor Co., Ltd.Hamamatsu Photonics KKKoito Manufacturing Co., Ltd.Minolta Co., Ltd.Nichia Corp.Kennametal, Inc.Hisense Visual Technology Co., Ltd.Shibaura Mechatronics Corp.Polyplastics Co., Ltd.Lite-On Technology Corp.Canon Electronics, Inc.Han's Laser Technology Industry Group Co., Ltd.Optoma Corp.Waymo LLCCanon Marketing Japan, Inc.Shibuya Corp.Gwangju Institute of Science & TechnologyKEYENCE Corp.Leica Geosystems AGLeica Geosystems AGShandong Normal UniversityMKS Instruments, Inc.Appotronics Corp. Ltd.
LG Electronics, Inc.Sharp Corp.Ericsson, Inc.Nippon Telegraph & Telephone Corp.Kyocera Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Oki Electric Industry Co., Ltd.Electronics & Telecommunications Research InstituteAlcatel-Lucent S ANTT DOCOMO, Inc.Showa Denko Materials Co. Ltd.Resonac Corp.Western Electric Co., Inc.Fujikura Ltd.Hitachi Metals, Ltd.Proterial Ltd.vivo Mobile Communication Co., Ltd.Nokia Siemens Networks OyLucent Technologies, Inc.BT Group PlcChina Mobile Communications Group Co., Ltd.China Mobile Communications Group Co., Ltd.Mannesmann AGJapan Aviation Electronics Industry Ltd.SK Telecom Co., Ltd.BlackBerry Ltd.Nubia Technology Co., Ltd.Nanjing University of Posts & TelecommunicationsKDDI Corp.
Hamamatsu Photonics KKFinisar Corp.Finisar Corp.IPG Photonics Corp.Mellanox Technologies Ltd.Physik Instrumente (PI) GmbH & Co. KGRockley Photonics Ltd.Molex Korea Co., Ltd.Acacia Communications, Inc.Skorpios Technologies, Inc.Elenion Technologies LLCKotura, Inc.Teem Photonics SAHinds Instruments, Inc.SiLC Technologies, Inc.Aurrion, Inc.Sicoya GmbHLightwave Logic, Inc.AvicenaTech Corp.Ranovus, Inc.Aeponyx, Inc.Genalyte, Inc.Vlink Optics Corp.NAsP III/V GmbHOneChip Photonics, Inc.Greenteg AGOptoscribe Ltd.Edmund Optics, Inc.KEOPSYS SASchfter + Kirchhoff GmbH
Canon, Inc.Canon, Inc.Fujitsu Ltd.Sharp Corp.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Resonac Corp.Sumitomo Metal Industries Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.TCL China Star Optoelectronics Technology Co., Ltd.NXP Semiconductors (Thailand) Co., Ltd.NGK SPARK PLUG CO., LTD.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Toppan, Inc.Fraunhofer-Gesellschaft eVSamsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Resonac Corp.
Fraunhofer-Gesellschaft eVFujikura Ltd.Hitachi Metals, Ltd.Proterial Ltd.SNECMA SAHamamatsu Photonics KKChina University of Petroleum (East China)China University of Petroleum (East China)Tamura Corp.HIROSE ELECTRIC CO., LTD.Lawrence Livermore National LaboratoryPolitechnika WroclawskaCiena Corp.De la Rue International Ltd.MKS Instruments, Inc.Tatsuta Electric Wire & Cable Co., Ltd.Tatsuta Electric Wire & Cable Co., Ltd.iconectiv LLCHisense Broadband Multimedia Technologies Co., Ltd.Seikoh Giken Co., Ltd.Hisense Broadband Multimedia Technologies Co., Ltd.Toshiba Materials Co., Ltd.Finisar Corp.Finisar Corp.MPI Corp.Lumentum Operations LLCIPG Photonics Corp.Mellanox Technologies Ltd.OFS Fitel LLCBIONEER Corp.