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General Electric Co.Honeywell International, Inc.The Boeing Co.Thales GroupSubaru Corp.LIG Nex1 Co., Ltd.SNECMA SARaytheon Co.Subaru Corp.Beihang UniversityLucas Industries PlcDaicel Corp.KYB Corp.Hughes Aircraft Co.Airbus Operations Ltd.SZ DJI Technology Co., Ltd.Raytheon Technologies Corp.Japan Aviation Electronics Industry Ltd.Hamilton Sundstrand Corp.AlliedSignal, Inc.Eclipse Aviation Corp.Tektronix, Inc.Deutsches Zentrum für Luft- und Raumfahrt e.V.United Aircraft Corp.Analog Devices, Inc.Mitsubishi Cable Industries Ltd.Voith GmbH & Co. KGaAMesserschmitt-Boelkow-Blohm GmbHMesserschmitt-Boelkow-Blohm GmbHNorthrop Grumman Systems Corp.
Palo Alto Research Center, Inc.HRL Laboratories LLCTata Motors Ltd.Paramount GlobalColder Products Co.Consort Medical Ltd.University of Dayton Research InstituteMoSys, Inc.Takeda Pharmaceuticals U.S.A., Inc.Cyalume Technologies, Inc.JSW Steel Ltd.Viking Technology, Inc.Adlink Technology, Inc.University of Toledo Medical CenterSuper Talent Technology Corp.RAONTECH, Inc.The Quantum Group, Inc.Advanced Medical Solutions Ltd.Advanced Medical Solutions Ltd.United Monolithic Semiconductors SASDIAB International ABBrite Semiconductor (Shanghai) Corp.Barts & The London NHS TrustFarmers Edge, Inc.Mobileum, Inc.CMC Materials Taiwan Co., Ltd.Solace Power, Inc.AnPac Bio-Medical Science Co., Ltd.HAN-Bürogerte GmbH & Co. KGArgosy Research, Inc.
Boe Innovation Investment Co. Ltd.Honeywell International, Inc.Thales GroupAlps Alpine Co., Ltd.Raytheon Co.NGK SPARK PLUG CO., LTD.Hamamatsu Photonics KKRaytheon Technologies Corp.Japan Aviation Electronics Industry Ltd.Nippon Seiki Co., Ltd.LAPIS Semiconductor Co. Ltd.Analog Devices, Inc.DePuy Synthes Products, Inc.Rosemount, Inc.Dr. Johannes Heidenhain GmbHThe Georgia Tech Research Corp.Shenzhen Goodix Technology Co., Ltd.Shenzhen Goodix Technology Co., Ltd.Furuno Electric Co., Ltd.Novatek Microelectronics Corp.Asahi Kasei Microdevices Corp.Meizu Technology Co. Ltd.Tamagawa Seiki Co., Ltd.KEYENCE Corp.Weidmüller Interface GmbH & Co. KGFerranti Ltd.Piaggio & C SpAB/E Aerospace, Inc.Piaggio & C SpACooper Industries LLC
Avidyne Corp.Esterline Technologies Corp.uAvionix Corp.
General Electric Co.General Electric Co.Japan Aviation Electronics Industry Ltd.SCHOTT AGAlliedSignal, Inc.Eclipse Aviation Corp.Angang Steel Co., Ltd.Bose Corp.Pratt & Whitney Canada Corp.NUCTECH Co., Ltd.Textron, Inc.Dürr Systems, Inc.Babcock International Ltd.Rockwell Collins, Inc.Jiangxi Hongdu Aviation Industry (Group) Corp. Ltd.Sikorsky Aircraft Corp.AECC Shenyang Liming Aero-Engine Co., Ltd.North American Aviation, Inc.Bombardier, Inc.FAG Kugelfischer AG & Co. KGAECC South Industry Co., Ltd.AECC Aviation Power Co., Ltd.Airbus SASShowa Aircraft Industry Co., Ltd.AeroVironment, Inc.GE Aviation Systems Ltd.Magang (Group) Holding Co., Ltd.AT & S Austria Technologie & Systemtechnik AGDassault Aviation SASinopec Yangzi Petrochemical Co., Ltd.
Diehl Aerospace GmbHElbit Systems of America LLCL-3 Communication Security & Detection Systems Corp.Garmin International, Inc.Astronautics Corporation of AmericaAstronics Corp.Global Eagle Entertainment, Inc.Aspen Avionics, Inc.Esterline Technologies Corp.AvioVision NVuAvionix Corp.DAC International, Inc.Teledyne Controls LLC
LG Electronics, Inc.Sharp Corp.Huawei Technologies Co., Ltd.Ericsson, Inc.Nippon Telegraph & Telephone Corp.ZTE Corp.Kyocera Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Alcatel-Lucent S ANTT DOCOMO, Inc.Showa Denko Materials Co. Ltd.Resonac Corp.Western Electric Co., Inc.Fujikura Ltd.Hitachi Metals, Ltd.Proterial Ltd.vivo Mobile Communication Co., Ltd.Nokia Siemens Networks OyLucent Technologies, Inc.BT Group PlcChina Mobile Communications Group Co., Ltd.China Mobile Communications Group Co., Ltd.telent Ltd.Mannesmann AGJapan Aviation Electronics Industry Ltd.SK Telecom Co., Ltd.BlackBerry Ltd.Tokyo Electric Power Co. Holdings, Inc.Nubia Technology Co., Ltd.Sony Ericsson Mobile Communications AB
