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Xerox Holdings Corp.Avery Dennison Corp.Miyazaki Epson Corp.Zenith Electronics LLCSymbol Technologies, Inc.Spectrum Brands, Inc.TomTom International BVPHC Holdings Corp.Miwa Lock Co., Ltd.Star Micronics Co., Ltd.Shandong New Beiyang Information Technology Co., Ltd.Zebra Technologies Corp.Shandong New Beiyang Information Technology Co., Ltd.Siemens AG ÖsterreichSensormatic Electronics LLCProMOS Technologies, Inc.Indesit Company SpAEM Microelectronic-Marin SAKYOCERA AVX Components Corp.Harada Industry Co., Ltd.pSemi Corp.Marchesini Group SpABinder GmbHLeica Biosystems Nussloch GmbHShenzhen Genvict Technologies Co., Ltd.Macdermid Enthone, Inc.Krber AGKrber AGArizon RFID Technology Co., Ltd.ZIH Corp.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Sony Group Corp.LG Electronics, Inc.Fujitsu Ltd.Sharp Corp.Ricoh Co., Ltd.Seiko Epson Corp.SANYO Electric Co., Ltd.Intel Corp.Apple, Inc.FUJIFILM Corp.BOE Technology Group Co., Ltd.Hewlett-Packard Development Co.Brother Industries, Ltd.Eastman Kodak Co.Boe Innovation Investment Co. Ltd.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fujifilm Business Innovation Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Xerox Holdings Corp.Oki Electric Industry Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Mita Industrial Co., Ltd.Micron Technology, Inc.Toppan, Inc.
Samsung Electronics Co., Ltd.LG Electronics, Inc.General Electric Co.General Electric Co.Sharp Corp.Seiko Epson Corp.SANYO Electric Co., Ltd.E.I. du Pont de Nemours & Co.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.Apple, Inc.Brother Industries, Ltd.KYOCERA Chemical Corp.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Toshiba Chemical Corp.Fujifilm Business Innovation Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Daewoo Electronics Co. Ltd.DAIKIN INDUSTRIES Ltd.Honeywell International, Inc.Nitto Electric Industrial Co. Ltd.Kobe Steel, Ltd.Casio Computer Co., Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Resonac Corp.Sumitomo Metal Industries Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.TCL China Star Optoelectronics Technology Co., Ltd.NXP Semiconductors (Thailand) Co., Ltd.
Canon, Inc.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.Taiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Toppan, Inc.Fraunhofer-Gesellschaft eVSamsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Resonac Corp.South China University of TechnologySoutheast University