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Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Oki Electric Industry Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Micron Technology, Inc.Toppan, Inc.Fraunhofer-Gesellschaft eVAGC, Inc. (Japan)ABB Automation, Inc.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.
Neturen Co., Ltd.SPC Electronics Corp.Park-Ohio Industries, Inc.Radyne Corp.Miyaden Co., Ltd.Inductoheat, Inc.Shanghai Heatking Induction Technology Co., Ltd.Inductotherm Industries Shanghai Ltd.Stanelco RF Technologies Ltd.Efd Induction SASAET SpAGH Electrotermia SACojafexAmbrell Corp.National Taitung Junior CollegeDinex International, Inc.ITG Induktionsanlagen GmbHDKK Co., Ltd.Inductotherm Coating Equipment SAEMAG eldec Induction GmbHLectrotherm, Inc.EFD Induction (Shanghai) Co., Ltd.MagComp ABLuxine, Inc.
Samsung Electronics Co., Ltd.Sony Group Corp.LG Electronics, Inc.General Electric Co.General Electric Co.Sharp Corp.Seiko Epson Corp.SANYO Electric Co., Ltd.E.I. du Pont de Nemours & Co.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.Apple, Inc.Brother Industries, Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.KYOCERA Chemical Corp.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Toshiba Chemical Corp.Fujifilm Business Innovation Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Daewoo Electronics Co. Ltd.DAIKIN INDUSTRIES Ltd.Honeywell International, Inc.Nitto Electric Industrial Co. Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Oki Electric Industry Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Micron Technology, Inc.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Resonac Corp.Sumitomo Metal Industries Ltd.
Sulzer Management AGC. Uyemura & Co., Ltd.Eltech Systems Corp.Gilardini SpANitta Haas, Inc.Omnichem Co., Ltd.Park-Ohio Industries, Inc.Hemoteq AGOC Oerlikon Balzers AGExergy, Inc.Proma Technologies, Inc.HzO, Inc.Sanyu Co., Ltd.Thermocompact SATechnic, Inc.KoMiCo Ltd.Ways Technical Corp., Ltd.Richard Whr GmbhWhitford Corp.Corona Kogyo Corp.Metallurg, Inc.Anhui Hangyu Paimeng Radiation Protection Technology Co.Specialty Coating Systems, Inc.Tianqi Lithium Corp.CemeCon AGInterplex Industries, Inc.SPS Technologies LLCChromatic Technologies, Inc.SAM automotive production GmbHNishina Industrial Co. Ltd.
General Electric Co.General Electric Co.Honeywell International, Inc.The Boeing Co.Thales GroupSubaru Corp.LIG Nex1 Co., Ltd.SNECMA SARaytheon Co.Subaru Corp.Beihang UniversityLucas Industries PlcDaicel Corp.KYB Corp.Hughes Aircraft Co.Airbus Operations Ltd.SZ DJI Technology Co., Ltd.Raytheon Technologies Corp.Japan Aviation Electronics Industry Ltd.BASF Corp.Hamilton Sundstrand Corp.AlliedSignal, Inc.Eclipse Aviation Corp.Tektronix, Inc.Deutsches Zentrum für Luft- und Raumfahrt e.V.United Aircraft Corp.Messerschmitt-Boelkow-Blohm GmbHMesserschmitt-Boelkow-Blohm GmbHNorthrop Grumman Systems Corp.Pratt & Whitney Canada Corp.