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Samsung Electronics Co., Ltd.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Toppan, Inc.Samsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.South China University of TechnologySoutheast University
DENSO Corp.KYOCERA Chemical Corp.Taiwan Semiconductor Manufacturing Co., Ltd.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Showa Denko Materials Co. Ltd.Resonac Corp.South China University of TechnologyEbara Corp.SCREEN Holdings Co., Ltd.University of Electronic Science & Technology of ChinaAdvanced Micro Devices, Inc.Lam Research Corp.Hangzhou Dianzi UniversitySemiconductor Components Industries LLCULVAC, Inc.JUKI Corp.Macronix International Co., Ltd.Shin-Etsu Handotai Co., Ltd.SEMES Co., Ltd.LAPIS Semiconductor Co. Ltd.Shinko Electric Industries Co., Ltd.Shinko Electric Industries Co., Ltd.Realtek Semiconductor Corp.Fujitsu Semiconductor Ltd.DB HITEK Co., Ltd.Advanced Semiconductor Engineering, Inc.Skyworks Solutions, Inc.Shenzhen Goodix Technology Co., Ltd.Shenzhen Goodix Technology Co., Ltd.
Taiwan Semiconductor Manufacturing Co., Ltd.SEMES Co., Ltd.Shinko Electric Industries Co., Ltd.Shinko Electric Industries Co., Ltd.Advanced Semiconductor Engineering, Inc.Tokyo Seimitsu Co., Ltd.Siliconware Precision Industries Co., Ltd.MKS Instruments, Inc.STATS ChipPAC Pte Ltd.MPI Corp.Powertech Technology, Inc.JCET Group Co., Ltd.Namics Corp.AT & S Austria Technologie & Systemtechnik AGTongFu Microelectronics Co., Ltd.Xintec, Inc.JAPAN ELECTRONIC MATERIALS CORP.JAPAN ELECTRONIC MATERIALS CORP.HANMI Semiconductor Co., Ltd.King Yuan Electronics Co., Ltd.Chipbond Technology Corp.Amkor Technology, Inc.NEPES Corp.HANA MICRON, Inc.Walton Advanced Engineering, Inc.Subtron Technology Co., Ltd.Foshan Nationstar Semiconductor Co., Ltd.Lingsen Precision Industries Ltd.Kinsus Interconnect Technology Corp.Samsung Semiconductor, Inc.
3M Innovative Properties Co.Eastman Kodak Co.Motorola, Inc.Kyoraku Sangyo KKYeda Research & Development Co. Ltd.Worldwide Specialty Property Services Pty Ltd.Worldwide Specialty Property Services Pty Ltd.Mastercard International, Inc.Yissum Research Development Co. Ltd.Purdue Research FoundationPalo Alto Research Center, Inc.Ampex Corp.Disney Enterprises, Inc.IP2IPO Innovations Ltd.Ramot at Tel Aviv University Ltd.Konkuk University Industry-Academic Cooperation FoundationImagination Technologies Ltd.Intellectual Discovery Co., Ltd.Energy Conversion Devices, Inc.Appotronics Corp. Ltd.Mosaid Technologies, Inc.UCL Business Ltd.International Engine Intellectual Property Co. LLCInternational Truck Intellectual Property Co. LLCDigimarc Corp.Ansaldo Energia IP UK Ltd.Conversant Wireless Licensing SARLLongitude Licensing Ltd.Tecpharma Licensing AGMasimo Corp.
Taiwan Semiconductor Manufacturing Co., Ltd.Samsung Electro-Mechanics Co., Ltd.Semiconductor Components Industries LLCSEMES Co., Ltd.Shinko Electric Industries Co., Ltd.Shinko Electric Industries Co., Ltd.Fujitsu Semiconductor Ltd.Advanced Semiconductor Engineering, Inc.Nanya Technology Corp.Polaris Innovations Ltd.Siliconware Precision Industries Co., Ltd.Qimonda AGSTATS ChipPAC Pte Ltd.Invensas Corp.Powertech Technology, Inc.JCET Group Co., Ltd.AT & S Austria Technologie & Systemtechnik AGTongFu Microelectronics Co., Ltd.Xintec, Inc.King Yuan Electronics Co., Ltd.Chipbond Technology Corp.Amkor Technology, Inc.NEPES Corp.Advanced Chip Engineering Technology, Inc.HANA MICRON, Inc.Camtek Ltd.3D Plus SASTianshui Huatian Technology Co., Ltd.Tianshui Huatian Technology Co., Ltd.Micron Technology Taiwan, Inc.
Samsung Electronics Co., Ltd.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Sumitomo Metal Industries Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.TCL China Star Optoelectronics Technology Co., Ltd.NXP Semiconductors (Thailand) Co., Ltd.NGK SPARK PLUG CO., LTD.NXP BVTCL China Star Optoelectronics Technology Co., Ltd.
Fraunhofer-Gesellschaft eVToyota Central R&D Labs, Inc.Semiconductor Components Industries LLCShinko Electric Industries Co., Ltd.Shinko Electric Industries Co., Ltd.Advanced Semiconductor Engineering, Inc.Polaris Innovations Ltd.Dowa Electronics Materials Co., Ltd.Siliconware Precision Industries Co., Ltd.Qimonda AGPower Integrations, Inc.International Rectifier Corp.STATS ChipPAC Pte Ltd.Nuvoton Technology Corp.Powertech Technology, Inc.JCET Group Co., Ltd.eMemory Technology, Inc.Hitachi AIC, Inc.SANYO Semiconductor Co., Ltd.Xintec, Inc.Etron Technology, Inc.King Yuan Electronics Co., Ltd.Chipbond Technology Corp.Shenzhen Sunlord Electronics Co., Ltd.Amkor Technology, Inc.Princo Corp.NEPES Corp.HANA MICRON, Inc.Xiamen San'an Integrated Circuit Co., Ltd.Camtek Ltd.
