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Axcelis Technologies, Inc.Advanced Micro Fabrication Equipment, Inc. ChinaAdvanced Micro Fabrication Equipment, Inc. ChinaNissin Ion Equipment Co., Ltd.Intevac, Inc.OC Oerlikon Balzers AGTherma-Wave, Inc.Advanced Ion Beam Technology, Inc.SemEquip, Inc.Wonik QnC Corp.IHI Hauzer Techno Coating BVmi2-factory GmbHHigh Voltage Engineering Europa BVIHI Ionbond AGKokusai Semiconductor Equipment Corp.Tec-Sem USA, Inc.ULVAC Technologies, Inc.KST World Corp.
Koninklijke Philips NVKoninklijke Philips NVSeiko Epson Corp.E.I. du Pont de Nemours & Co.EIDP, Inc.DAIKIN INDUSTRIES Ltd.Fraunhofer-Gesellschaft eVPOSCO Holdings Inc.JFE Holdings, Inc.South China University of TechnologySoutheast UniversityIndustrial Technology Research InstituteShowa Denko K.K.Resonac Holdings Corp.Shanghai Jiao Tong UniversityDIC CorporationZhejiang University of TechnologyMassachusetts Institute of TechnologyHarbin Institute of TechnologyHuazhong University of Science & TechnologyFunai Electric Co., Ltd.University of Electronic Science & Technology of ChinaKorea Advanced Institute of Science & TechnologySumitomo Bakelite Co., Ltd.Beihang UniversityKunming University of Science & TechnologyDalian University of TechnologyWuhan UniversityAmorepacific Corp.Tongji University
Canon, Inc.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.Taiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Toppan, Inc.Fraunhofer-Gesellschaft eVSamsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Resonac Corp.South China University of Technology
Samsung Electronics Co., Ltd.LG Electronics, Inc.General Electric Co.General Electric Co.Sharp Corp.Seiko Epson Corp.SANYO Electric Co., Ltd.E.I. du Pont de Nemours & Co.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.Apple, Inc.Brother Industries, Ltd.KYOCERA Chemical Corp.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Toshiba Chemical Corp.Fujifilm Business Innovation Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Daewoo Electronics Co. Ltd.DAIKIN INDUSTRIES Ltd.Honeywell International, Inc.Nitto Electric Industrial Co. Ltd.Kobe Steel, Ltd.Casio Computer Co., Ltd.
Nihon Denso KKKYOCERA Chemical Corp.DAIKIN INDUSTRIES Ltd.Schaeffler Technologies AG & Co. KGABB Automation, Inc.John Deere (Pty) Ltd.Southeast UniversityFujitsu General Ltd.Iseki & Co., Ltd.Hitachi Metals, Ltd.Proterial Ltd.ABB Automation, Inc.Daimler-Benz Aerospace AGHitachi Construction Machinery Co., Ltd.ASML Netherlands BVFunai Electric Co., Ltd.Carrier Corp.Hitachi Zosen Corp.USM Ltd.Qingdao Haier Air Conditioner Co., Ltd.Advantest Corp.Minolta Co., Ltd.Daido Steel Co., Ltd.Harbin University of Science & TechnologyFried. Krupp GmbHChevron, Inc.Mitsubishi Agricultural Machinery Co. Ltd.Babcock Hitachi KKHitachi Appliances, Inc.NEC Platforms Ltd.
Veeco Instruments, Inc.Ion Beam Applications SAMeyer Burger (Germany) AGEl-Mul Technologies Ltd.NFAB Ltd.Omniprobe, Inc.Oxford Instruments Plasma Technology Ltd.Imago Scientific Instruments Corp.E.A. Fischione Instruments, Inc.CVC, Inc.NexGen Semi Holding, Inc.National Electrostatics Corp.IONpath, Inc.Vault Creation Co. Ltd.Penguin SystemCommonwealth Scientific Corp
Gracel Display, Inc.MBK Co., Ltd. (Korea)Techneglas LLC