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General Electric Co.General Electric Co.Honeywell International, Inc.The Boeing Co.Thales GroupSubaru Corp.SNECMA SARaytheon Co.Subaru Corp.Beihang UniversityLucas Industries PlcDaicel Corp.KYB Corp.Hughes Aircraft Co.Airbus Operations Ltd.SZ DJI Technology Co., Ltd.Raytheon Technologies Corp.Japan Aviation Electronics Industry Ltd.Hamilton Sundstrand Corp.AlliedSignal, Inc.Eclipse Aviation Corp.Tektronix, Inc.Deutsches Zentrum für Luft- und Raumfahrt e.V.United Aircraft Corp.Analog Devices, Inc.Mitsubishi Cable Industries Ltd.Voith GmbH & Co. KGaAMesserschmitt-Boelkow-Blohm GmbHMesserschmitt-Boelkow-Blohm GmbHNorthrop Grumman Systems Corp.
Thales GroupMesserschmitt-Boelkow-Blohm GmbHNorthrop Grumman Systems Corp.The Korean Agency for Defense Development (South Korea)Société Nationale Industrielle Aérospatiale SAFourth Military Medical UniversityChina Academy of Launch Vehicle TechnologyHazeltine Corp.AECC Shenyang Liming Aero-Engine Co., Ltd.McDonnell Douglas Corp.Hughes Tool Co.Harbin Aircraft Industrial Group Co. Ltd.Martin Marietta Corp.Western Atlas International, Inc.Beijing Institute of Space Launch TechnologyFN Herstal NVMobileye Vision Technologies Ltd.Shanghai Aircraft Manufacturing Co. Ltd.Smith & Wesson, Inc.China Avionics Systems Co., Ltd.China Aviation Power Machinery Research InstituteAVIC Xi'an Aircraft Industry Group Co., Ltd.Zhengzhou Xindajiean Information Technology Co., Ltd.CIMC Safeway Technology Co., Ltd.TRW Systèmes Aeronautiques SASHuiyang Aviation Propeller Co., Ltd.Xian Aerospace Engine CorpZhangjiagang CIMC Sanctum Cryogenic Equipment Co., Ltd.Shaanxi Baocheng Aviation Instrument Co., Ltd.Zhengzhou Aircraft Equipment Co., Ltd.
Samsung Electronics Co., Ltd.LG Electronics, Inc.General Electric Co.Sharp Corp.Seiko Epson Corp.SANYO Electric Co., Ltd.E.I. du Pont de Nemours & Co.EIDP, Inc.Intel Corp.Sumitomo Electric Industries Ltd.Apple, Inc.Brother Industries, Ltd.KYOCERA Chemical Corp.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Toshiba Chemical Corp.Kyocera Corp.Fujifilm Business Innovation Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Daewoo Electronics Co. Ltd.DAIKIN INDUSTRIES Ltd.Honeywell International, Inc.Kobe Steel, Ltd.Casio Computer Co., Ltd.Midea Group Co. Ltd.Electronics & Telecommunications Research Institute
Japan Aviation Electronics Industry Ltd.Wistron NeWeb Corp.Fitbit, Inc.HiDeep, Inc. (Old)Bernecker + Rainer Industrie-Elektronik GmbHSiglent Technologies Co., Ltd.Canatu OyKodiak Networks, Inc.Azoteq (Pty) Ltd.Oblong Industries, Inc.VIA Telecom, Inc.CanvasBio Co. Ltd.Yappa Corp.Aito BVRolls-Royce Nuclear Field Services, Inc.ART Advanced Recognition Technologies, Inc.Frontier Silicon Ltd.Picsel Technologies Ltd.Alteryx, Inc.Lindinvent ABIntelligent Fiber Optic Systems, Inc.Ramco Systems Ltd.ON24, Inc.ArcScan, Inc.optek-Danulat GmbHOceans, Inc.Enigmatec Corp. Ltd.ELAN Home Systems LLCD2 Technologies, Inc.Candu Labs Ltd.
Canon, Inc.Canon, Inc.Fujitsu Ltd.Sharp Corp.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Resonac Corp.Sumitomo Metal Industries Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.TCL China Star Optoelectronics Technology Co., Ltd.NXP Semiconductors (Thailand) Co., Ltd.NGK SPARK PLUG CO., LTD.
Canon, Inc.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.Taiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Toppan, Inc.Fraunhofer-Gesellschaft eVSamsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Resonac Corp.South China University of Technology
Japan Aviation Electronics Industry Ltd.Trimble Navigation Ltd.Shaanxi Baocheng Aviation Instrument Co., Ltd.Shaanxi Baocheng Aviation Instrument Co., Ltd.Universal Avionics Systems Corp.Safran Electronics & Defense, Avionics USA LLCCMC Electronics, Inc.Fiagon GmbHBecker Flugfunkwerk GmbHMicroStrain, Inc.Systron Donner Inertial, Inc.