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MiTAC International Corp.Toray Engineering Co., Ltd.Kennede Electronics Mfg Co., Ltd.Kennede Electronics MFG Co., Ltd.Panda Electronics Group Co., Ltd.Eastern Communications Co., Ltd.Ionics, Inc.Jabil, Inc.ExcelStor Technology Ltd.Whelen Engineering Co., Inc.Universal Instruments Corp.Shenzhen Everbest Machinery Industry Co., Ltd.Shenzhen Zowee Tech Co., Ltd.Kong Yue Electronics & Information Industry (Xin Hui) Ltd.Kong Yue Electronics & Information Industry (Xin Hui) Ltd.BTU International, Inc.Xcerra Corp.Three-Five Systems, Inc.SUMIDA Components & Modules GmbHSUMIDA Components & Modules GmbHSpirox Corp.SUN-A Corp.Suzhou Etron Technologies Co., Ltd.Suzhou Etron Technologies Co., Ltd.Redcom Laboratories, Inc.Kaga Electronics Co., Ltd.Tianyu Communication Technology Kunshan Co. Ltd.Tianyu Communication Technology Kunshan Co. Ltd.Truly Electronics Manufacturing Ltd.Celestica International, Inc.
International Business Machines Corp.Dow Global Technologies LLCMicrosoft Corp.Hewlett Packard Enterprise Development LPBoston Scientific Scimed, Inc.Baidu Online Network Technology (Beijing) Co., Ltd.NCR Corp.Citrix Systems, Inc.VMware, Inc.NetEase (Hangzhou) Network Co., Ltd.Avaya, Inc.Heroku, Inc.Alcatel-Lucent Shanghai Bell Co., Ltd.Beijing Gridsum Technology Co., Ltd.Beijing Gridsum Technology Co., Ltd.ServiceNow, Inc.NTT DATA Corp.Baidu USA LLCDropbox, Inc.Megvii (Beijing) Technology Co., Ltd.NTT Communications Corp.United Video Properties, Inc.Genesys Cloud Services, Inc.Xing, Inc.Alibaba Cloud Computing Ltd.Cerner Innovation, Inc.Akamai Technologies, Inc.Guangzhou Huaduo Network Technology Co., Ltd.Ikegami Tsushinki Co., Ltd.Guangzhou Huaduo Network Technology Co., Ltd.
International Business Machines Corp.Fujitsu Ltd.Eastman Kodak Co.Google LLC3M Co.Microsoft Corp.Beijing Xiaomi Mobile Software Co., Ltd.Beijing Xiaomi Mobile Software Co., Ltd.Baidu Online Network Technology (Beijing) Co., Ltd.BlackBerry Ltd.Deutsche Telekom AGDeutsche Telekom AGGemalto, Inc.Sega Group Corp.Beijing Jingdong Shangke Information Technology Co., Ltd.Beijing Jingdong Shangke Information Technology Co., Ltd.LEGO A/SLEGO A/SVMware, Inc.NetEase (Hangzhou) Network Co., Ltd.Altera Corp.SK Planet Co., Ltd.Avaya, Inc.HGST, Inc.Heroku, Inc.Alcatel-Lucent Shanghai Bell Co., Ltd.Sandvik AktiebolagOlivetti SpASaudi Basic Industries Corp.CA Technologies, Inc.
International Business Machines Corp.Microsoft Corp.Baidu Online Network Technology (Beijing) Co., Ltd.BlackBerry Ltd.Wistron Corp.Orange SATata Consultancy Services Ltd.NetEase (Hangzhou) Network Co., Ltd.Canon Electronics, Inc.Hitachi Software Engineering Co., Ltd.Hitachi Software Engineering Co., Ltd.Heroku, Inc.Alcatel-Lucent Shanghai Bell Co., Ltd.NAVER Corp.NEC Soft Ltd.ThyssenKrupp Presta AGBeijing Gridsum Technology Co., Ltd.Beijing Gridsum Technology Co., Ltd.Mosaid Technologies, Inc.Power Integrations, Inc.TRUMPF Werkzeugmaschinen GmbH + Co. KGBaidu USA LLCDigimarc Corp.Asahi Techno Co., Ltd.Megvii (Beijing) Technology Co., Ltd.United Video Properties, Inc.Miracle Automation Engineering Co., Ltd.Miracle Automation Engineering Co., Ltd.BioMarin Pharmaceutical, Inc.Xing, Inc.
Samsung Electronics Co., Ltd.Canon, Inc.International Business Machines Corp.Fujitsu Ltd.General Electric Co.Huawei Technologies Co., Ltd.Seiko Epson Corp.SANYO Electric Co., Ltd.Intel Corp.Apple, Inc.ZTE Corp.FUJIFILM Corp.Hewlett-Packard Development Co.Eastman Kodak Co.Fujifilm Business Innovation Corp.Google LLCFujifilm Business Innovation Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Honeywell International, Inc.Xerox Holdings Corp.Tencent Technology (Shenzhen) Co., Ltd.Motorola, Inc.Alcatel-Lucent S AOlympus Corp.Microsoft Corp.Beijing Xiaomi Mobile Software Co., Ltd.Toyota Industries Corp.Muratec Automation Co., Ltd.Victor Company of Japan Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Resonac Corp.Sumitomo Metal Industries Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.TCL China Star Optoelectronics Technology Co., Ltd.NXP Semiconductors (Thailand) Co., Ltd.NGK SPARK PLUG CO., LTD.
Samsung Electronics Co., Ltd.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Toppan, Inc.Samsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.South China University of Technology
