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Samsung Electronics Co., Ltd.LG Electronics, Inc.General Electric Co.Sharp Corp.Seiko Epson Corp.SANYO Electric Co., Ltd.E.I. du Pont de Nemours & Co.EIDP, Inc.Sumitomo Electric Industries Ltd.Apple, Inc.Brother Industries, Ltd.KYOCERA Chemical Corp.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Toshiba Chemical Corp.Fujifilm Business Innovation Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Daewoo Electronics Co. Ltd.DAIKIN INDUSTRIES Ltd.Honeywell International, Inc.Nitto Electric Industrial Co. Ltd.Kobe Steel, Ltd.Casio Computer Co., Ltd.Midea Group Co. Ltd.Electronics & Telecommunications Research Institute
Hisonic, Inc.
Bombardier, Inc.The Timken Co.AIRBUS HELICOPTERS DEUTSCHLAND GmbHSouthwest Aluminium (Group) Co., Ltd.Southwest Aluminium (Group) Co., Ltd.Airbus SASLufthansa Technik AGGoodyear Aerospace Corp.Goodyear Aerospace Corp.KUKA Systems GmbHFACC AGLISI AEROSPACE SASBarnes Group, Inc.SmartSky Networks LLCAeronext, Inc.Broetje-Automation GmbHAgusta SpASingapore Airlines Ltd.Jetoptera, Inc.The NORDAM Group LLCKenu, Inc.AmSafe, Inc.Jiangsu Digital Eagle Technology Development Co. Ltd.Jiangsu Digital Eagle Technology Development Co. Ltd.Deutsche Lufthansa AGSGL Composites, Inc.Wall Colmonoy Corp.Dow Ut Composite Products, Inc.PCC Structurals, Inc.Gemcor II LLC
Boe Innovation Investment Co. Ltd.Honeywell International, Inc.Thales GroupAlps Alpine Co., Ltd.Raytheon Co.NGK SPARK PLUG CO., LTD.Hamamatsu Photonics KKRaytheon Technologies Corp.Japan Aviation Electronics Industry Ltd.Nippon Seiki Co., Ltd.Freescale Semiconductor, Inc.LAPIS Semiconductor Co. Ltd.Analog Devices, Inc.DePuy Synthes Products, Inc.Rosemount, Inc.Dr. Johannes Heidenhain GmbHThe Georgia Tech Research Corp.Shenzhen Goodix Technology Co., Ltd.Shenzhen Goodix Technology Co., Ltd.Furuno Electric Co., Ltd.Novatek Microelectronics Corp.Asahi Kasei Microdevices Corp.Meizu Technology Co. Ltd.Tamagawa Seiki Co., Ltd.KEYENCE Corp.Weidmüller Interface GmbH & Co. KGFerranti Ltd.Piaggio & C SpAB/E Aerospace, Inc.Piaggio & C SpA
Ericsson, Inc.The Boeing Co.Russia Federal Space AgencyThales GroupKDDI Corp.Deutsche Telekom AGDeutsche Telekom AGDeutsches Zentrum für Luft- und Raumfahrt e.V.National Aeronautics & Space AdministrationHuf Hülsbeck & Fürst GmbH & Co. KGAmpex Corp.FCI SAT-Mobile USA, Inc.Nagravision SANisshinbo Micro Devices, Inc.Korea Aerospace Research InstituteViaSat, Inc.Ball Corp.Wistron NeWeb Corp.Telefónica SASECOM Co., Ltd.Shenzhen Skyworth Digital Technology Co., Ltd.Shenzhen Skyworth Digital Technology Co., Ltd.Japan Aerospace Exploration AgencyShenzhen Coship Electronics Co., Ltd.ArianeGroup SASIsrael Aerospace Industries Ltd.China Academy of Space TechnologyKATHREIN-Werke KGAirbus SAS
General Electric Co.General Electric Co.Honeywell International, Inc.The Boeing Co.Thales GroupSubaru Corp.SNECMA SARaytheon Co.Subaru Corp.Beihang UniversityLucas Industries PlcDaicel Corp.KYB Corp.Hughes Aircraft Co.Airbus Operations Ltd.SZ DJI Technology Co., Ltd.Raytheon Technologies Corp.Japan Aviation Electronics Industry Ltd.BASF Corp.Hamilton Sundstrand Corp.AlliedSignal, Inc.Eclipse Aviation Corp.Tektronix, Inc.Deutsches Zentrum für Luft- und Raumfahrt e.V.United Aircraft Corp.Analog Devices, Inc.Mitsubishi Cable Industries Ltd.Voith GmbH & Co. KGaAMesserschmitt-Boelkow-Blohm GmbHMesserschmitt-Boelkow-Blohm GmbH
