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Samsung Electronics Co., Ltd.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Toppan, Inc.Samsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.South China University of Technology
DENSO Corp.KYOCERA Chemical Corp.Taiwan Semiconductor Manufacturing Co., Ltd.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Showa Denko Materials Co. Ltd.Resonac Corp.South China University of TechnologyEbara Corp.SCREEN Holdings Co., Ltd.University of Electronic Science & Technology of ChinaAdvanced Micro Devices, Inc.Lam Research Corp.Hangzhou Dianzi UniversitySemiconductor Components Industries LLCULVAC, Inc.JUKI Corp.Macronix International Co., Ltd.Shin-Etsu Handotai Co., Ltd.SEMES Co., Ltd.LAPIS Semiconductor Co. Ltd.Shinko Electric Industries Co., Ltd.Shinko Electric Industries Co., Ltd.Fujitsu Semiconductor Ltd.DB HITEK Co., Ltd.Advanced Semiconductor Engineering, Inc.Skyworks Solutions, Inc.Shenzhen Goodix Technology Co., Ltd.Shenzhen Goodix Technology Co., Ltd.HGST, Inc.
National Semiconductor Corp.Atmel Corp.AVIC Jonhon Optronic Technology Co., Ltd.AVIC Jonhon Optronic Technology Co., Ltd.Qorvo US, Inc.Novuton Technology Corp. JapanSilicon Storage Technology, Inc.KMW, Inc.Anhui Tatfook Technology Co., Ltd.Smiths Group PlcTongyu Communication, Inc.Tongding Interconnection Information Co., Ltd.Speed Tech Corp.GigaLane Co., Ltd.PARTRON Co., Ltd.DEXIN Corp.AngioDynamics, Inc.RichWave Technology Corp.INPAQ Technology Co., Ltd.Sunwave Communications Co., Ltd.RF360 Europe GmbHAvic Forstar S&T Co., Ltd.Wuhan Fingu Electronic Technology Co., Ltd.Jiangsu Hengxin Technology Co., Ltd.Officine di Cartigliano SpAWuhan Fingu Electronic Technology Co., Ltd.Jiangsu Hengxin Technology Co., Ltd.Nanjing Changfeng Aerospace Electronics Technology Co. Ltd.Nanjing Changfeng Aerospace Electronics Technology Co. Ltd.Galtronics Corp. Ltd. /Israel/
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Resonac Corp.Sumitomo Metal Industries Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.TCL China Star Optoelectronics Technology Co., Ltd.NXP Semiconductors (Thailand) Co., Ltd.
Hon Hai Precision Industry Co., Ltd.Sonos, Inc.Nordic Semiconductor ASAJMA LLCEnOcean GmbHVIZIO, Inc.Taoglas Ltd.Espressif Systems (Shanghai) Co., Ltd.Espressif Systems (Shanghai) Co., Ltd.Newracom, Inc.Queclink Wireless Solutions Co., Ltd.RF Monolithics, Inc.Queclink Wireless Solutions Co., Ltd.Sequans Communications SAEagleView Technologies, Inc.Option NVON Semiconductor Connectivity Solutions, Inc.Arlo Technologies, Inc.NEXCOM International Co., Ltd.Wirepas OyMerrimac Industries, Inc.ETS-Lindgren, Inc.GainSpan Corp.Newport Media, Inc.Artimi Ltd.Pepex Biomedical, Inc.Synapse Wireless, Inc.Forkbeard TechnologiesSource Photonics, Inc.iDevices LLC
MediaTek, Inc.Realtek Semiconductor Corp.Arcadyan Technology Corp.Allied Telesis Holdings K.K.Sunwave Communications Co., Ltd.Seibu Electric Industry Co., Ltd.Level One Communications, Inc.Microsystems InternationalRF Micro Devices, Inc.Proxim Corp.Tensorcom, Inc.Stratos Lightwave, Inc.Senao Networks, Inc.Bandspeed, Inc.GAON CABLE Co., Ltd.I-Sheng Electric Wire & Cable Co., Ltd.SpiderCloud Wireless, Inc.LANKom Electronics Ltd.Spirea ABSpirea ABBeMap, Inc.Planet Technology Corp.International Verifact, Inc.Azaire Networks, Inc.Sangsangin Co., Ltd.Comtec Systems Co., Ltd.ReefEdge, Inc.3C Tae Yang Co., Ltd.Antlabs Pte Ltd.Suzhou Hanming Technology Co., Ltd.
Hitachi Ltd.LG Electronics, Inc.Toyota Motor Corp.International Business Machines Corp.Fujitsu Ltd.General Electric Co.General Electric Co.Huawei Technologies Co., Ltd.Ericsson, Inc.ZTE Corp.Apple, Inc.Boe Innovation Investment Co. Ltd.Honeywell International, Inc.Xerox Holdings Corp.Bayerische Motoren Werke AGAlcatel-Lucent S ANTT DOCOMO, Inc.Renesas Electronics Corp.Dow Global Technologies LLCMicrosoft Corp.Toshiba Lighting & Technology Corp.Toyoda Gosei Co., Ltd.Toshiba Lighting & Technology Corp.Hilti AGMediaTek, Inc.Aisin AW Co., Ltd.Boston Scientific Scimed, Inc.Advanced Micro Devices, Inc.telent Ltd.Azbil Corp.