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LG Electronics, Inc.Sharp Corp.Huawei Technologies Co., Ltd.Ericsson, Inc.Nippon Telegraph & Telephone Corp.ZTE Corp.Kyocera Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Electronics & Telecommunications Research InstituteMotorola, Inc.Alcatel-Lucent S ANTT DOCOMO, Inc.Showa Denko Materials Co. Ltd.Western Electric Co., Inc.Fujikura Ltd.Hitachi Metals, Ltd.Proterial Ltd.vivo Mobile Communication Co., Ltd.Nokia Siemens Networks OyLucent Technologies, Inc.China Mobile Communications Group Co., Ltd.China Mobile Communications Group Co., Ltd.telent Ltd.Mannesmann AGJapan Aviation Electronics Industry Ltd.SK Telecom Co., Ltd.BlackBerry Ltd.Motorola Solutions, Inc.Tokyo Electric Power Co. Holdings, Inc.
Huawei Technologies Co., Ltd.Ericsson, Inc.Intel Corp.Nippon Telegraph & Telephone Corp.ZTE Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Motorola, Inc.NTT DOCOMO, Inc.vivo Mobile Communication Co., Ltd.Nokia Siemens Networks OyMediaTek, Inc.China Mobile Communications Group Co., Ltd.China Mobile Communications Group Co., Ltd.SZ DJI Technology Co., Ltd.telent Ltd.Mannesmann AGSK Telecom Co., Ltd.BlackBerry Ltd.Xiaomi Corp.Motorola Solutions, Inc.Nubia Technology Co., Ltd.KDDI Corp.China United Network Communications Ltd.Beijing University of Posts & TelecommunicationsMotorola Solutions Credit Co. LLCGuangzhou Shiyuan Electronic Technology Co. Ltd.Guangzhou Shiyuan Electronic Technology Co. Ltd.Deutsche Telekom AGHangzhou H3C Technologies Co., Ltd.
Nuvotronics, Inc.AIRTEC SYSTEM Co., Ltd.Universal Microwave Technology, Inc.Universal Microwave Technology, Inc.Xponent Photonics, Inc.Superconductor Technology Co., Ltd.
National Semiconductor Corp.Atmel Corp.AVIC Jonhon Optronic Technology Co., Ltd.AVIC Jonhon Optronic Technology Co., Ltd.Qorvo US, Inc.Novuton Technology Corp. JapanSilicon Storage Technology, Inc.Anhui Tatfook Technology Co., Ltd.Nations Technologies, Inc.Smiths Group PlcTongyu Communication, Inc.Tongding Interconnection Information Co., Ltd.MaxLinear, Inc.Speed Tech Corp.GigaLane Co., Ltd.PARTRON Co., Ltd.DEXIN Corp.AngioDynamics, Inc.RichWave Technology Corp.E-TEN Information Systems Co., Ltd.INPAQ Technology Co., Ltd.NEW POWER PLASMA Co., Ltd.RF360 Europe GmbHParkerVision, Inc.EZconn Corp.Wuhan Fingu Electronic Technology Co., Ltd.Officine di Cartigliano SpAWuhan Fingu Electronic Technology Co., Ltd.Jiangsu Hengxin Technology Co., Ltd.ISCO International, Inc.
thyssenkrupp Industrial Solutions AGSMS group GmbHAlstom SAXcellerex, Inc.STATS ChipPAC Pte Ltd.HYUNDAI ROTEM Co.ChipMOS Technologies, Inc.MULTIVAC Sepp Haggenmüller SE & Co. KGSaipem SAChroma Ate, Inc.Mühlbauer GmbH & Co. KGHarnischfeger Corp.Ansaldo Energia SpAEd. Züblin AGBWG Bergwerk- und Walzwerk-Maschinenbau GmbHSuzhou Secote Precision Electronic Co., Ltd.Imagineering, Inc.Bluewater Energy Services BVGeico SpAClextral SASHenan Communications Planning & Design Institute Co., Ltd.Hosokawa Alpine AGHydro International Ltd.Converteam SASLingzhi Environmental Protection Co., Ltd.Lanzhou LS Heavy Equipment Co., Ltd.Lanzhou LS Heavy Equipment Co., Ltd.Lingzhi Environmental Protection Co., Ltd.Leclanché SAMH Robot & Automation Co., Ltd.
General Electric Co.Honeywell International, Inc.The Boeing Co.Thales GroupSubaru Corp.SNECMA SARaytheon Co.Subaru Corp.Beihang UniversityLucas Industries PlcDaicel Corp.KYB Corp.Hughes Aircraft Co.Airbus Operations Ltd.SZ DJI Technology Co., Ltd.Raytheon Technologies Corp.Japan Aviation Electronics Industry Ltd.Hamilton Sundstrand Corp.AlliedSignal, Inc.Eclipse Aviation Corp.Tektronix, Inc.Deutsches Zentrum für Luft- und Raumfahrt e.V.United Aircraft Corp.Analog Devices, Inc.Mitsubishi Cable Industries Ltd.Voith GmbH & Co. KGaAMesserschmitt-Boelkow-Blohm GmbHMesserschmitt-Boelkow-Blohm GmbHNorthrop Grumman Systems Corp.Pratt & Whitney Canada Corp.