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Intel Corp.3M Innovative Properties Co.Taiwan Semiconductor Manufacturing Co., Ltd.Bayerische Motoren Werke AGJFE Holdings, Inc.Advantest Corp.NIKE, Inc.Chongqing Changan Automobile Co. Ltd.Milliken & Co. (South Carolina)Lear Corp.International Paper Co.Nanya Technology Corp.Varian Semiconductor Equipment Associates, Inc.Delta Faucet Co.Atlas Copco ABBrembo SpACrown Equipment Corp.Shanghai Zhenhua Heavy Industries Co., Ltd.Power Integrations, Inc.Wistron NeWeb Corp.Samsung C&T Corp.Hitachi-LG Data Storage, Inc.Jack Technology Co., Ltd.Xiamen Solex High-Tech Industries Co. Ltd.Jack Technology Co., Ltd.Xiamen Solex High-Tech Industries Co. Ltd.HMD Global OyAutodesk, Inc.FARO Technologies, Inc.Dassault Systèmes SA
International Business Machines Corp.Fujitsu Ltd.Tencent Technology (Shenzhen) Co., Ltd.Yokogawa Electric Corp.Hewlett Packard Enterprise Development LPSeagate Technology LLCDelphi Technology, Inc.Praxair S.T. Technology, Inc.Dolby International ABLife Technologies Corp.Unisys Corp.Tata Consultancy Services Ltd.VMware, Inc.Inspur Electronic Information Industry Co., Ltd.Avaya, Inc.MiTAC International Corp.SnapTrack, Inc.Siemens Medical Solutions USA, Inc.Heroku, Inc.Agfa-Gevaert NVLandmark Graphics Corp.Fiberhome Telecommunication Technologies Co., Ltd.Shima Seiki Mfg. Ltd.Shima Seiki Mfg. Ltd.NARI Technology Co., Ltd.Rambus, Inc.Canon Marketing Japan, Inc.HRL Laboratories LLCBull SANEC Soft Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Toppan, Inc.Samsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.South China University of Technology
NHC Communications, Inc.Glodon Co., Ltd.Cethik Group Co.,Ltd.DONGWON SYSTEMS Corp.Prime Electronics & Satellitics, Inc.Wuhan Xingtu Xinke Electronics Co., Ltd.Naltec, Inc.Shenzhen Yitian Internet Co. Ltd.Liming Network Systems Co. Ltd.Insigma Technology Co. Ltd.Vascode Technologies Ltd.Meriton Networks, Inc.Davicom Semiconductor, Inc.Ceno Technologies Ltd.ClariPhy Communications, Inc.Hywire Ltd.Digital Now, Inc.Solidum Systems Corp.Integration Associates, Inc.Globecomm Systems, Inc.Red-C Optical Networks Ltd.
Taiwan Semiconductor Manufacturing Co., Ltd.Shin-Etsu Chemical Co., Ltd.Shin-Etsu Handotai Co., Ltd.Angang Steel Co., Ltd.Shin-Etsu Polymer Co., Ltd.Wuhan Iron & Steel Co., Ltd.Soitec SAWuhan Iron & Steel Group Corp.Fujimi, Inc.Elpida Memory, Inc.Siltronic AGPrimetals Technologies Austria GmbHElkem ASAElectro Scientific Industries, Inc.Silicon Laboratories, Inc.AIXTRON SENippon Steel & Sumikin Coated Sheet Corp.Inner Mongolia Baotou Steel Union Co. Ltd.Hirata Corp.LX Semicon Co., Ltd.GlobalWafers Co., Ltd.eMemory Technology, Inc.Silicon Integrated Systems Corp.Silicon Integrated Systems Corp.Faraday Technology Corp.Fujian Longking Co., Ltd.OSAKA Titanium Technologies Co., Ltd.GigaLane Co., Ltd.Anshan Iron & Steel Group Corp.Fujikoshi Machinery Corp.