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Sharp Corp.Hamamatsu Photonics KKOSRAM Opto Semiconductors GmbHNichia Corp.Han's Laser Technology Industry Group Co., Ltd.Han's Laser Technology Industry Group Co., Ltd.Optoma Corp.MKS Instruments, Inc.Novuton Technology Corp. JapanAlcon Laboratories, Inc.ZKW Group GmbHFARO Technologies, Inc.Nippon Avionics Co., Ltd.Finisar Corp.Finisar Corp.Johnson & Johnson Surgical Vision, Inc.Lumentum Operations LLCIPG Photonics Corp.Wuhan Raycus Fiber Laser Technologies Co., Ltd.Nippon Filcon Co., Ltd.IMRA America, Inc.TRUMPF Laser GmbH + Co. KGTRUMPFFocused Photonics (Hangzhou), Inc.Focused Photonics (Hangzhou), Inc.Abbott Medical Optics, Inc.nLIGHT, Inc.Bystronic Laser AGThorlabs, Inc.Christie Digital Systems USA, Inc.
Samsung Electronics Co., Ltd.Canon, Inc.LG Electronics, Inc.International Business Machines Corp.Fujitsu Ltd.Sharp Corp.Ricoh Co., Ltd.Ricoh Co., Ltd.Seiko Epson Corp.SANYO Electric Co., Ltd.Intel Corp.Apple, Inc.ZTE Corp.FUJIFILM Corp.BOE Technology Group Co., Ltd.Hewlett-Packard Development Co.Brother Industries, Ltd.Eastman Kodak Co.Boe Innovation Investment Co. Ltd.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fujifilm Business Innovation Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Xerox Holdings Corp.Semiconductor Energy Laboratory Co., Ltd.Mita Industrial Co., Ltd.Toppan, Inc.Konica Minolta, Inc.
Samsung Electronics Co., Ltd.LG Electronics, Inc.General Electric Co.Sharp Corp.Seiko Epson Corp.SANYO Electric Co., Ltd.E.I. du Pont de Nemours & Co.EIDP, Inc.Intel Corp.Sumitomo Electric Industries Ltd.Apple, Inc.Brother Industries, Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.KYOCERA Chemical Corp.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Toshiba Chemical Corp.Fujifilm Business Innovation Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Daewoo Electronics Co. Ltd.DAIKIN INDUSTRIES Ltd.Honeywell International, Inc.Nitto Electric Industrial Co. Ltd.Kobe Steel, Ltd.Casio Computer Co., Ltd.
Microsoft Corp.Xilinx, Inc.CA Technologies, Inc.General Dynamics Corp.Yokowo Co. Ltd.Fukuvi Chemical Industry Co., Ltd.Briggs & Stratton Corp.Asahi Intecc Co., Ltd.Bombardier Recreational Products, Inc.Huizhou Desay SV Automotive Co., Ltd.Huizhou Desay SV Automotive Co., Ltd.ZF Automotive Germany GmbHWoodward, Inc.Federal-Mogul Burscheid GmbHAnalogic Corp.Gen Digital Inc.NortonLifeLock, Inc.Arcadyan Technology Corp.Nanosys, Inc.Qibu Co., Ltd.Federal-Mogul Motorparts LLCShape LLCHydrogenics Corp.The Valspar Corp.CDTi Advanced Materials, Inc.Fingerprint Cards ABSymbios, Inc.Powermat Technologies Ltd.Energy Recovery, Inc.Chassis Brakes International BV
Canon, Inc.Ricoh Co., Ltd.Ricoh Co., Ltd.Fujifilm Business Innovation Corp.Fujifilm Business Innovation Corp.Casio Computer Co., Ltd.Fraunhofer-Gesellschaft eVOlympus Corp.Daihatsu Motor Co., Ltd.Hamamatsu Photonics KKDISCO Corp.Koito Manufacturing Co., Ltd.Minolta Co., Ltd.OSRAM Opto Semiconductors GmbHNichia Corp.JSWKennametal, Inc.Hisense Visual Technology Co., Ltd.Polyplastics Co., Ltd.Lite-On Technology Corp.Han's Laser Technology Industry Group Co., Ltd.Canon Electronics, Inc.Han's Laser Technology Industry Group Co., Ltd.Optoma Corp.Waymo LLCCanon Marketing Japan, Inc.Shibuya Corp.Gwangju Institute of Science & TechnologyKEYENCE Corp.Leica Geosystems AG