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EnBIO Ltd.SouthWing SLMorey Corp.Boston Engineering Corp.Noraker SARLH2B2 Electrolysis Technologies SL
Samsung Electronics Co., Ltd.LG Electronics, Inc.General Electric Co.Sharp Corp.Seiko Epson Corp.SANYO Electric Co., Ltd.E.I. du Pont de Nemours & Co.EIDP, Inc.Intel Corp.Sumitomo Electric Industries Ltd.Apple, Inc.Brother Industries, Ltd.KYOCERA Chemical Corp.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Toshiba Chemical Corp.Fujifilm Business Innovation Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Daewoo Electronics Co. Ltd.DAIKIN INDUSTRIES Ltd.Honeywell International, Inc.Nitto Electric Industrial Co. Ltd.Kobe Steel, Ltd.Casio Computer Co., Ltd.Midea Group Co. Ltd.
Hitachi Ltd.Alps Alpine Co., Ltd.Fujitsu General Ltd.Meidensha Corp.YASKAWA Electric Corp.Koito Manufacturing Co., Ltd.KoitoYanmar Co., Ltd.Sanden Corp.Sony Semiconductor Solutions Corp.Nissin Electric Co., Ltd.Tektronix, Inc.Shindengen Electric Manufacturing Co. Ltd.Valeo Schalter und Sensoren GmbHOrgano Corp.Square D Co.Rittal GmbH & Co. KGNARI Technology Co., Ltd.XJ Group Corp.Maschinenfabrik Reinhausen GmbHMaschinenfabrik Reinhausen GmbHZhejiang Chint Electrics Co., Ltd.Bull SAXJ Electric Co., Ltd.AVIC Jonhon Optronic Technology Co., Ltd.Pinggao Group Co., Ltd.Pinggao Group Co., Ltd.NARI Group Corp.General Signal Corp.The Gleason Works, Inc.
Samsung Electronics Co., Ltd.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Sumitomo Metal Industries Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.TCL China Star Optoelectronics Technology Co., Ltd.NXP Semiconductors (Thailand) Co., Ltd.NGK SPARK PLUG CO., LTD.NXP BVTCL China Star Optoelectronics Technology Co., Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Toppan, Inc.Samsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.South China University of TechnologySoutheast University
Intel Corp.3M Innovative Properties Co.Taiwan Semiconductor Manufacturing Co., Ltd.Bayerische Motoren Werke AGJanssen Pharmaceutica NVAdvantest Corp.NIKE, Inc.Chongqing Changan Automobile Co. Ltd.Milliken & Co. (South Carolina)Raychem Corp.Lear Corp.International Paper Co.Nanya Technology Corp.Varian Semiconductor Equipment Associates, Inc.Delta Faucet Co.Atlas Copco ABBrembo SpAPACCAR, Inc.Shanghai Zhenhua Heavy Industries Co., Ltd.Power Integrations, Inc.Wistron NeWeb Corp.Samsung C&T Corp.Hitachi-LG Data Storage, Inc.Xiamen Solex High-Tech Industries Co. Ltd.Jack Technology Co., Ltd.Xiamen Solex High-Tech Industries Co. Ltd.HMD Global OyAutodesk, Inc.FARO Technologies, Inc.JUUL Labs, Inc.
