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Alps Alpine Co., Ltd.Rosemount, Inc.Dr. Johannes Heidenhain GmbHTakata, Inc.Tamagawa Seiki Co., Ltd.Yamato-Scale Co., Ltd.Key Safety Systems, Inc.Watlow Electric Manufacturing Co.Watlow Electric Manufacturing Co.Draeger Safety, Inc.Preh GmbHPepperl+Fuchs, Inc.Kistler Holding AGBorgWarner Ludwigsburg GmbHInterface, Inc.FIGARO Engineering, Inc.Nippon Ceramic Co., Ltd.Tactual Labs Co.Hottinger Baldwin Messtechnik GmbHMeasurement Specialties, Inc.IDEX Biometrics ASAOmega Engineering, Inc.Zhonghang Electronic Measuring Instruments Co., Ltd.Autonics Corp.Zhonghang Electronic Measuring Instruments Co., Ltd.Electricfil Automotive SASKeli Sensing Technology (Ningbo) Co., Ltd.Keli Sensing Technology (Ningbo) Co., Ltd.I.G. Bauerhin GmbHCrane Electronics Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Oki Electric Industry Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Micron Technology, Inc.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Resonac Corp.Sumitomo Metal Industries Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Toppan, Inc.Samsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.South China University of TechnologySoutheast UniversitySumitomo Metal Industries Ltd.
AFP Imaging Corp.s::can GmbH
General Electric Co.General Electric Co.Honeywell International, Inc.The Boeing Co.Thales GroupSubaru Corp.Raytheon Co.Subaru Corp.Beihang UniversityLucas Industries PlcDaicel Corp.KYB Corp.Hughes Aircraft Co.SZ DJI Technology Co., Ltd.Raytheon Technologies Corp.Japan Aviation Electronics Industry Ltd.BASF Corp.Hamilton Sundstrand Corp.AlliedSignal, Inc.Eclipse Aviation Corp.Tektronix, Inc.Deutsches Zentrum für Luft- und Raumfahrt e.V.United Aircraft Corp.Analog Devices, Inc.Mitsubishi Cable Industries Ltd.Voith GmbH & Co. KGaAMesserschmitt-Boelkow-Blohm GmbHMesserschmitt-Boelkow-Blohm GmbHNorthrop Grumman Systems Corp.Pratt & Whitney Canada Corp.
Control4 Corp.Iconloop, Inc.X-COM Systems LLCRane Corp.United Pan-Europe Communications NV