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Samsung Electronics Co., Ltd.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Toppan, Inc.Samsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.South China University of TechnologySoutheast University
Yokogawa Electric Corp.Advantest Corp.Tektronix, Inc.Rohde & Schwarz GmbH & Co. KGKeysight Technologies, Inc.Chroma Ate, Inc.LitePoint Corp.Leader Electronics Corp.Chauvin Arnoux SASMotech Industries, Inc.Keithley Instruments LLCNF Holdings Corp.Teledyne LeCroy, Inc.Chomerics, Inc.Ivivi Technologies, Inc.ETS-Lindgren, Inc.Good Will Instrument Co., Ltd.Infinite Electronics, Inc.Farran Technology Ltd.Giga-tronics, Inc.Marshall Electronics, Inc.IFEN GmbHASTRODESIGN, Inc.
Imperial Chemical Industries Ltd.KYOCERA Chemical Corp.Daikin Airconditioning France SASDAIKIN INDUSTRIES Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Illinois Tool Works, Inc.Fujitsu General Ltd.ABB Automation, Inc.Idemitsu Kosan Co., Ltd.ASML Netherlands BVOtis Elevator Co.Nippon Kayaku Co., Ltd.USM Ltd.Qingdao Haier Air Conditioner Co., Ltd.PPG Industries Ohio, Inc.NOK Corp.Shimizu Corp.Evonik Operations GmbHHanon SystemsBabcock Hitachi KKHitachi Appliances, Inc.NEC Platforms Ltd.Maschinenfabrik Rieter AGHarris Intertype Corp.Sophia Co. Ltd.Sophia Co. Ltd.Qingdao Haier Washing Machine Co., Ltd.Freescale Semiconductor, Inc.SEMES Co., Ltd.
Xerox Holdings Corp.Toshiba Tec Corp.Avery Dennison Corp.Symbol Technologies, Inc.TomTom International BVPHC Holdings Corp.Miwa Lock Co., Ltd.Star Micronics Co., Ltd.Shandong New Beiyang Information Technology Co., Ltd.Zebra Technologies Corp.Shandong New Beiyang Information Technology Co., Ltd.Siemens AG ÖsterreichProMOS Technologies, Inc.Indesit Company SpAKYOCERA AVX Components Corp.Harada Industry Co., Ltd.pSemi Corp.Marchesini Group SpABinder GmbHLeica Biosystems Nussloch GmbHKESPION Co., Ltd.Shenzhen Genvict Technologies Co., Ltd.LitePoint Corp.Uhlmann Pac-Systeme GmbH & Co. KGKrber AGKrber AGArizon RFID Technology Co., Ltd.ZIH Corp.Tsinghua Tongfang Co., Ltd.PolyIC GmbH & Co. KG
Samsung Electronics Co., Ltd.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Sumitomo Metal Industries Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.TCL China Star Optoelectronics Technology Co., Ltd.NXP Semiconductors (Thailand) Co., Ltd.NGK SPARK PLUG CO., LTD.NXP BVTCL China Star Optoelectronics Technology Co., Ltd.
Samsung Electronics Co., Ltd.Micron Technology, Inc.MagnaChip Semiconductor Ltd.DB HITEK Co., Ltd.Gentex Corp.Huaian Imaging Device Manufacturer Corp.Huaian Imaging Device Manufacturer Corp.Unity Opto Technology Co., Ltd.Rockley Photonics Ltd.IHP GmbH - Innovations for High Performance MicroelectronicsInvensas Bonding Technologies, Inc.National Chi Nan UniversityFoveon, Inc.MOBOTIX AGAvnera Corp.Tung Thih Electronic Co., Ltd.Skorpios Technologies, Inc.Lightmatter, Inc.Brigates Microelectronics Inc.Tower Semiconductor Ltd.Pixelplus Co., Ltd.Akustica, Inc.AmberWave Systems Corp.MEMSIC, Inc.Sofics BVBASilicon Optronics, Inc.Insiava Pty Ltd.Xiroku, Inc.New Imaging Technologies SADecaWave Ltd.
