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telent Ltd.Schneider Electric USA, Inc.Fibocom Wireless, Inc.CAE, Inc.RGB Systems, Inc.LGS Innovations LLCNuCurrent, Inc.Beijing Mech-Mind Robotics Technologies Co., Ltd.Danobat S. Coop.WiSpry, Inc.ObjectVideo, Inc.Adam Hall GmbHSigma Additive Solutions, Inc.Element AI, Inc.Mecachrome France SASNEC Corporation of AmericaShenzhen Honglu Technology Co., Ltd.Siemens Rail Automation Pty Ltd.Prudent Energy Inc.KA Imaging, Inc.Fengtai Technology (Beijing) Co. Ltd.Kuka Systems North America LLCTongue LaboratoryWallix SARLBlue Spark Technologies, Inc.Speech Processing Solutions GmbHKuka Systems North America LLCRockwell Collins Deutschland GmbHBlue Sky Research, Inc.Coronis SAS
Samsung Electronics Co., Ltd.LG Electronics, Inc.General Electric Co.Sharp Corp.Seiko Epson Corp.SANYO Electric Co., Ltd.E.I. du Pont de Nemours & Co.EIDP, Inc.Intel Corp.Sumitomo Electric Industries Ltd.Apple, Inc.Brother Industries, Ltd.KYOCERA Chemical Corp.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Toshiba Chemical Corp.Fujifilm Business Innovation Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Daewoo Electronics Co. Ltd.DAIKIN INDUSTRIES Ltd.Honeywell International, Inc.Nitto Electric Industrial Co. Ltd.Kobe Steel, Ltd.Casio Computer Co., Ltd.Midea Group Co. Ltd.