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Samsung Electronics Co., Ltd.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Toppan, Inc.Fraunhofer-Gesellschaft eVSamsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.South China University of Technology
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Sony Group Corp.International Business Machines Corp.Fujitsu Ltd.General Electric Co.General Electric Co.Huawei Technologies Co., Ltd.Seiko Epson Corp.SANYO Electric Co., Ltd.ZTE Corp.Apple, Inc.FUJIFILM Corp.Hewlett-Packard Development Co.Eastman Kodak Co.Fujifilm Business Innovation Corp.Fujifilm Business Innovation Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Honeywell International, Inc.Xerox Holdings Corp.Oki Electric Industry Co., Ltd.Tencent Technology (Shenzhen) Co., Ltd.Alcatel-Lucent S AMicrosoft Corp.Beijing Xiaomi Mobile Software Co., Ltd.Toyota Industries Corp.Muratec Automation Co., Ltd.Victor Company of Japan Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Resonac Corp.Sumitomo Metal Industries Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.NXP Semiconductors (Thailand) Co., Ltd.NGK SPARK PLUG CO., LTD.NXP BV
Lite-On Technology Corp.MEDION AG
Samsung Electronics Co., Ltd.Hitachi Ltd.Funai Electric Co., Ltd.Tohoku Pioneer Corp.UJU ELECTRONICS Co., Ltd.KraussMaffei HighPerformance AGCMC Magnetics Corp.Memory-Tech Holdings, Inc.Optical Disc Corp.Henan Kerry Digital Co. Ltd.DPHI, Inc.Beijing E-World Technologies Co. Ltd.Allied Technologies (Suzhou) Co., Ltd.Steorn Ltd.Dacal Technology Corp.Midsummer ABHamaTech AGCinram Group, Inc.
Alps Alpine Co., Ltd.Dr. Johannes Heidenhain GmbHZebra Technologies Corp.Shenzhen Coship Electronics Co., Ltd.Dart Robot Co., Ltd.Princeton Technology Corp.Shenzhen Infinova Ltd.Chips & Media, Inc.Chieftek Precision Co., Ltd.LTN Servotechnik GmbHDr. Fritz Faulhaber GmbH & Co. KGVirata Corp.Virata Corp.Taiwan Alpha Electronic Co. Ltd.Elma Electronic, Inc.PIXTREE, Inc.WFE Technology Corp.Dexin Digital Technology Corp. Ltd.UDP Technology Ltd.Capella Microsystems (Taiwan), Inc.CUI, Inc.Dynapar Corp.Allied Motion Technologies, Inc.Teraburst Networks, Inc.Human Monitoring Ltd.SENSIO Technologies, Inc.Piher Sensors & Controls SAVicon Industries, Inc.Teresis Media Management, Inc.Everel Group SpA
Lite-On IT Corp.Access Co., Ltd.DEXIN Corp.Trek 2000 International Ltd.Cirque Corp.Sercomm Corp.Movea SACanaan Creative Co., Ltd.Innodisk Corp.ADTEX Inc.Axiohm SASIvani LLCLattice Energy Technology Corp.Tera SRLActions Semiconductor Co. Ltd.WFE Technology Corp.Oak Technology, Inc.Bandspeed, Inc.Dukosi Ltd.Imperas, Inc.Cypak ABSAND Technology, Inc.Future Dial, Inc.Kudelski SAZimplistic Pvt Ltd.MCCI Corp.CANDY HOUSE, Inc.Abalta Technologies, Inc.CEYX Technologies, Inc.Grass Wonder, Inc.