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Nidec Sankyo Corp.PayPal, Inc.Phison Electronics Corp.Hitachi Channel Solutions, Corp.Coin Acceptors, Inc.Alcor Micro Corp.Tai Twun Enterprise Co. Ltd.Lexar Media, Inc.ddm hopt + schuler GmbH & Co. KGLakala Payment Co., Ltd.Nidec Sankyo (Zhejiang) Corp.Szbroad Technology Co. Ltd.ENE Technology, Inc.United Fu Shen Chen Technology Corp.Clover Network, Inc.Etsy, Inc.TienPin Investment Holding Co., Ltd.Uniform Industrial Corp.ShenZhen iBOXPAY Information Technology Co., Ltd.China-Vision Intelligent Card Reader Co. Ltd.China-Vision Intelligent Card Reader Co. Ltd.MagTek, Inc.Airlink Technology Co. Ltd.Telxon Corp.Beijing Qiandaibao Payment Technology Ltd.SPYRUS, Inc.KICTeam, Inc.PNY Technologies, Inc.Alcorlink Corp.Changzhou Eversafe Electronic Lock Co., Ltd.
Samsung Electronics Co., Ltd.LG Electronics, Inc.General Electric Co.General Electric Co.Sharp Corp.Seiko Epson Corp.SANYO Electric Co., Ltd.E.I. du Pont de Nemours & Co.Intel Corp.Sumitomo Electric Industries Ltd.Apple, Inc.Sumitomo Electric Industries Ltd.Hon Hai Precision Industry Co., Ltd.SK hynix, Inc.Brother Industries, Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Toshiba Chemical Corp.Fuji Electronics Co., Ltd.LG Display Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Daewoo Electronics Co. Ltd.DAIKIN INDUSTRIES Ltd.Honeywell International, Inc.Kobe Steel, Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.LG Electronics, Inc.Fujitsu Ltd.Sharp Corp.Ricoh Co., Ltd.Seiko Epson Corp.SANYO Electric Co., Ltd.Intel Corp.FUJIFILM Corp.Apple, Inc.Hon Hai Precision Industry Co., Ltd.Samsung Display Co., Ltd.SK hynix, Inc.BOE Technology Group Co., Ltd.Brother Industries, Ltd.Eastman Kodak Co.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Boe Innovation Investment Co. Ltd.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.LG Display Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Xerox Holdings Corp.Oki Electric Industry Co., Ltd.Olympus Corp.Mita Industrial Co., Ltd.Micron Technology, Inc.
DENSO Corp.SK hynix, Inc.Taiwan Semiconductor Manufacturing Co., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Applied Materials, Inc.Micron Technology, Inc.Renesas Electronics Corp.Showa Denko Materials Co. Ltd.South China University of TechnologyResonac Corp.Ebara Corp.SCREEN Holdings Co., Ltd.University of Electronic Science & Technology of ChinaAdvanced Micro Devices, Inc.Lam Research Corp.DISCO Corp.KIOXIA Corp.United Microelectronics Corp.Hangzhou Dianzi UniversitySemiconductor Components Industries LLCULVAC, Inc.JUKI Corp.Macronix International Co., Ltd.Shin-Etsu Handotai Co., Ltd.Realtek Semiconductor Corp.LAPIS Semiconductor Co. Ltd.Shinko Electric Industries Co., Ltd.Shinko Electric Industries Co., Ltd.Microchip Technology, Inc.Fujitsu Semiconductor Ltd.