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Advanced Micro Devices, Inc.NVIDIA Corp.Realtek Semiconductor Corp.VIA Technologies, Inc.Cirrus Logic, Inc.Institute For Information IndustrySilicon Integrated Systems Corp.Silicon Integrated Systems Corp.Cambricon Technologies Corp. Ltd.ALi Corp.Rockchip Electronics Co., Ltd.LeadCore Technology Co. Ltd.Rockley Photonics Ltd.BitMain Technologies Holding Co.Anyka (Guangzhou) Microelectronics Technology Co., Ltd.Anyka (Guangzhou) Microelectronics Technology Co., Ltd.BitMain Technologies Holding Co.Graphcore Ltd.Cognitive Systems Corp.Ingenic Semiconductor Co., Ltd.Airgain, Inc.Ralink Technology Corp.Nan Ya Printed Circuit Board CorpTime Domain Corp.S3 Graphics Co. Ltd.SenseTime Group Ltd.Chipintelli Co. Ltd.Sambanova Systems, Inc.Beijing Horizon Robotics Technology Development Co., Ltd.Verisilicon Microelectronics (Shanghai) Co., Ltd.
Avid Identification Systems, Inc.Biolog-id SASTrüb Betriebs AG AarauRumitag SLRumitag SLDatamars Ibérica SLAllflex UK Ltd.Plastic Omnium Sistemas Urbanos SACromasa-Identificacion Electronica SA
Samsung Electronics Co., Ltd.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Sumitomo Metal Industries Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.TCL China Star Optoelectronics Technology Co., Ltd.NXP Semiconductors (Thailand) Co., Ltd.NGK SPARK PLUG CO., LTD.NXP BV
Samsung Electronics Co., Ltd.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Toppan, Inc.Samsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.South China University of Technology
Murakami Screen USA, Inc.Ovonyx, Inc.Altis Semiconductor SNCAltis Semiconductor SNCNaWoTec GmbHHamaTech APE GmbH & Co. KGTrivis Co. Ltd.Pixer Technology Ltd.Metamason, Inc.
Fujifilm Business Innovation Corp.Fujifilm Business Innovation Corp.Renesas Electronics Corp.Harman International Industries, Inc.Red Hat, Inc.Wangsu Science & Technology Co., Ltd.Wangsu Science & Technology Co., Ltd.Xintec, Inc.Synamedia Ltd.BMC Software, Inc.Airbiquity, Inc.China Greatwall Technology Group Co., Ltd.China Greatwall Technology Group Co., Ltd.President Chain Store Corp.Shandong Cvicse Middleware Co., Ltd.Shandong Zhongchuang Software Commercial Middleware Co., Ltd.Aeris Communications, Inc.Mavenir Systems, Inc.Synchronoss Technologies, Inc.Tao Group Ltd.Progress Software Corp.Sony Depthsensing Solutions SA/NVShenzhen Kingdee Middleware Co., Ltd.Shenzhen Kingdee Middleware Co., Ltd.Eexpway SATmaxSoft Inc.SeaChange International, Inc.SORACOM, INC.China TransInfo Technology Corp.Beijing Tongtech Co., Ltd.