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Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Toppan, Inc.Fraunhofer-Gesellschaft eVSamsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.
Electronics & Telecommunications Research InstituteASML Netherlands BVHyundai MicroElectronics Co., Ltd.Institute of Microelectronics of Chinese Academy of SciencesNovatek Microelectronics Corp.Beijing NAURA Microelectronics Equipment Co., Ltd.JOLED, Inc.Shanghai Huali Microelectronics Corp.Shanghai Huali Microelectronics Corp.Asahi Kasei Microdevices Corp.Tianma Microelectronics Co., Ltd.Wuhan Tian Ma Microelectronics Co., Ltd.Shanghai Tianma Microelectronics Co., Ltd.Xiamen Tianma Microelectronics Co., Ltd.Xiamen Tianma Microelectronics Co., Ltd.Heraeus Precious Metals GmbH & Co. KGElectro Scientific Industries, Inc.Sanechips Technology Co., Ltd.Nuvoton Technology Corp.MPI Corp.LX Semicon Co., Ltd.Fujitsu Microelectronics, Inc.ELAN Microelectronics Corp.InvenSense, Inc.Kateeva, Inc.Raydium Semiconductor Corp.Aselsan Elektronik Sanayi ve Ticaret ASShanghai AVIC Optoelectronics Co., Ltd.CMC Materials, Inc.Hangzhou Silan Microelectronics Co., Ltd.
National Semiconductor Corp.Atmel Corp.AVIC Jonhon Optronic Technology Co., Ltd.AVIC Jonhon Optronic Technology Co., Ltd.Qorvo US, Inc.Novuton Technology Corp. JapanSilicon Storage Technology, Inc.KMW, Inc.Anhui Tatfook Technology Co., Ltd.Smiths Group PlcTongyu Communication, Inc.Tongding Interconnection Information Co., Ltd.Speed Tech Corp.GigaLane Co., Ltd.PARTRON Co., Ltd.DEXIN Corp.AngioDynamics, Inc.RichWave Technology Corp.INPAQ Technology Co., Ltd.Sunwave Communications Co., Ltd.RF360 Europe GmbHAvic Forstar S&T Co., Ltd.Cognitive Systems Corp.Wuhan Fingu Electronic Technology Co., Ltd.Jiangsu Hengxin Technology Co., Ltd.Officine di Cartigliano SpAWuhan Fingu Electronic Technology Co., Ltd.Jiangsu Hengxin Technology Co., Ltd.Resonant, Inc.Nanjing Changfeng Aerospace Electronics Technology Co. Ltd.
Huawei Technologies Co., Ltd.Ericsson, Inc.Nippon Telegraph & Telephone Corp.ZTE Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Casio Computer Co., Ltd.Fraunhofer-Gesellschaft eVAlcatel-Lucent S ANTT DOCOMO, Inc.South China University of Technologyvivo Mobile Communication Co., Ltd.University of Electronic Science & Technology of ChinaMediaTek, Inc.BT Group PlcDatang Mobile Communications Equipment Co. Ltd.SK Telecom Co., Ltd.China Jiliang UniversityNubia Technology Co., Ltd.KDDI Corp.Motorola Mobility LLCDeutsche Telekom AGChina Telecom Corp. Ltd.Xilinx, Inc.Quanta Computer, Inc.Magic Leap, Inc.VMware, Inc.Skyworks Solutions, Inc.Rohde & Schwarz GmbH & Co. KGAlcatel-Lucent Shanghai Bell Co., Ltd.Nokia Shanghai Bell Co. Ltd.
Motorola Solutions Credit Co. LLCKonka Group Co., Ltd.Meizu Technology Co. Ltd.Changhong Meiling Co., Ltd.Gionee Communication Equipment Co. Ltd.HMD Global OyJCET Group Co., Ltd.pSemi Corp.Shanghai Awinic Technology Co., Ltd.RichWave Technology Corp.Chipbond Technology Corp.Win Semiconductors Corp.Smarter Microelectronics (Guangzhou) Co., Ltd.Lansus Technologies, Inc.Tianshui Huatian Technology Co., Ltd.Lansus Technologies, Inc.Tianshui Huatian Technology Co., Ltd.ON Semiconductor Connectivity Solutions, Inc.Vanchip (Tianjin) Technology Co., Ltd.Vanchip (Tianjin) Technology Co., Ltd.Maxscend Microelectronics Co., Ltd.TCL Communication Technology Holdings Ltd.Uniscope, Inc.SemiLEDs Corp.Zumigo, Inc.UFP Technologies, Inc.TIM SAEzetap Mobile Solutions Pvt Ltd.Dalian Daxian Takagi Mold Co. Ltd.TCL Communication Technology Holdings Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Resonac Corp.Sumitomo Metal Industries Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.
Samsung Electronics Co., Ltd.Fujitsu Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.OppoNTT DOCOMO, Inc.Haier Smart Home Co., Ltd.BYD Co., Ltd.Lenovo Group Ltd.Inventec Corp.British Telecommunications PlcJVCKenwood Corp.Xiaomi Corp.Motorola Solutions, Inc.Nubia Technology Co., Ltd.KDDI Corp.MagnaChip Semiconductor Ltd.Wuhan China Star Optoelectronics Technology Co., Ltd.Wuhan China Star Optoelectronics Technology Co., Ltd.Bose Corp.Hosiden Corp.Huizhou TCL Mobile Communication Co., Ltd.Shenzhen Goodix Technology Co., Ltd.Shenzhen Goodix Technology Co., Ltd.SnapTrack, Inc.Konka Group Co., Ltd.Immersion Corp.Primax Electronics Ltd.LG Uplus Corp.Meizu Technology Co. Ltd.Pantech & Curitel Communications, Inc.