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Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.Hon Hai Precision Industry Co., Ltd.Samsung Display Co., Ltd.SK hynix, Inc.BOE Technology Group Co., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Boe Innovation Investment Co. Ltd.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.LG Display Co., Ltd.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Oki Electric Industry Co., Ltd.Applied Materials, Inc.Micron Technology, Inc.Fraunhofer-Gesellschaft eVShin-Etsu Chemical Co., Ltd.TOPPAN Holdings, Inc.Guangzhou Bosma Optoelectronic Technology Co. Ltd.
Alcatel-Lucent S ADatang Mobile Communications Equipment Co. Ltd.Ericsson, Inc.Freescale Semiconductor, Inc.Realtek Semiconductor Corp.Hangzhou H3C Technologies Co., Ltd.Quanta Computer, Inc.Telecom Italia SpAHyundai WIA Corp.Ciena Corp.Viavi Solutions, Inc.LSI Corp.Wistron NeWeb Corp.IDEC Corp.Rosenberger Hochfrequenztechnik GmbH & Co. KGCETC Potevio Science & Technology Co., Ltd.Maipu Communication Technology Co., Ltd.Extreme Networks, Inc.China Academy of Information & Communication TechnologyAskey Computer Corp.IDEAL INDUSTRIES, Inc.China Academy of Information & Communication TechnologyBeckhoff Automation GmbH & Co. KGFaraday Technology Corp.JMA LLCArcadyan Technology Corp.TP-LINK Technologies Co., Ltd.ECI Telecom Ltd.ALAXALA Networks Corp.SOLiD, Inc.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Hon Hai Precision Industry Co., Ltd.Samsung Display Co., Ltd.SK hynix, Inc.BOE Technology Group Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.LG Display Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Oki Electric Industry Co., Ltd.Micron Technology, Inc.Shin-Etsu Chemical Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Showa Denko Materials Co. Ltd.Resonac Corp.STMicroelectronics SASumitomo Metal Industries Ltd.
Aprius, Inc.
Samsung Semiconductor, Inc.Hyperstone GmbHFrontier Silicon Ltd.Bay Microsystems, Inc.RGB Networks, Inc.MMC Networks, Inc.Xelex ABBreakingpoint Systems, Inc.Consystant Design Technologies, Inc.Consystant Design Technologies, Inc.Internet Machines Corp.
Gennum Corp.Bay Microsystems, Inc.Estijl Co, Ltd.
Hamamatsu Photonics KKFinisar Corp.Finisar Corp.Physik Instrumente (PI) GmbH & Co. KGRockley Photonics Ltd.NeoPhotonics Corp.Molex Korea Co., Ltd.Acacia Communications, Inc.Skorpios Technologies, Inc.Elenion Technologies LLCKotura, Inc.Teem Photonics SAHinds Instruments, Inc.SiLC Technologies, Inc.Aurrion, Inc.Sicoya GmbHLuxtera, Inc.Lightwave Logic, Inc.Anello Photonics, Inc.Ranovus, Inc.AA PlcReflex Photonics, Inc.Aeponyx, Inc.Wuhan RayoptekInnolume GmbHGenalyte, Inc.Vlink Optics Corp.NAsP III/V GmbHOneChip Photonics, Inc.Greenteg AG