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Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Hon Hai Precision Industry Co., Ltd.Samsung Display Co., Ltd.SK hynix, Inc.BOE Technology Group Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.LG Display Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Oki Electric Industry Co., Ltd.Micron Technology, Inc.Shin-Etsu Chemical Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Showa Denko Materials Co. Ltd.Resonac Corp.STMicroelectronics SASumitomo Metal Industries Ltd.
LG Electronics, Inc.Sharp Corp.Nippon Telegraph & Telephone Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Kyocera Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Oki Electric Industry Co., Ltd.Electronics & Telecommunications Research InstituteMotorola, Inc.NTT DOCOMO, Inc.Alcatel-Lucent S AShowa Denko Materials Co. Ltd.Western Electric Co., Inc.vivo Mobile Communication Co., Ltd.Resonac Corp.Fujikura Ltd.Hitachi Metals, Ltd.Nokia Siemens Networks OyChina Mobile Communications Group Co., Ltd.Lucent Technologies, Inc.China Mobile Communications Group Co., Ltd.Mannesmann AGJapan Aviation Electronics Industry Ltd.SK Telecom Co., Ltd.BlackBerry Ltd.Orange SAChina United Network Communications Group Co., Ltd.Huawei Device Co., Ltd.China Telecom Corp. Ltd.Nubia Technology Co., Ltd.
Canon, Inc.Ricoh Co., Ltd.Seiko Epson Corp.Brother Industries, Ltd.Yokogawa Electric Corp.Symbol Technologies, Inc.Symbol Technologies, Inc.Primax Electronics Ltd.LARGAN Precision Co., Ltd.NEC Display Solutions Ltd.Shandong New Beiyang Information Technology Co., Ltd.Allegro MicroSystems LLCShandong New Beiyang Information Technology Co., Ltd.Avision, Inc.Analogic Corp.Weber Maschinenbau GmbH BreidenbachKodak Alaris, Inc.3Shape A/S3Shape A/SACCO Brands Corp.Shanghai Hesai Technology Co., LtdAmerican Science & Engineering, Inc.Foxlink Image Technology Co., Ltd.Uniden Holdings Corp.Elscint Ltd.Bruin Biometrics LLCSmiths Heimann GmbHTeco Image Systems Co., Ltd.Shenzhen LeiShen Intelligent System Co., Ltd.Microtek International, Inc.
The Boeing Co.Thales GroupSNECMA SAThales SAKDDI Corp.Ericsson, Inc.Deutsches Zentrum für Luft- und Raumfahrt e.V.Deutsche Telekom AGHosiden Corp.Airbus Defence & Space GmbHNational Aeronautics & Space AdministrationHuf Hülsbeck & Fürst GmbH & Co. KGFCI SAAmpex Corp.Nisshinbo Micro Devices, Inc.ViaSat, Inc.Korea Aerospace Research InstituteMaspro Denkoh Corp.Yokowo Co. Ltd.Ball Corp.Wistron NeWeb Corp.Telefónica SASECOM Co., Ltd.Japan Aerospace Exploration AgencyShenzhen Skyworth Digital Technology Co., Ltd.Shenzhen Coship Electronics Co., Ltd.Israel Aerospace Industries Ltd.China Academy of Space TechnologyKATHREIN-Werke KGHexcel Corp.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.Hon Hai Precision Industry Co., Ltd.Samsung Display Co., Ltd.SK hynix, Inc.BOE Technology Group Co., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Boe Innovation Investment Co. Ltd.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.LG Display Co., Ltd.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Oki Electric Industry Co., Ltd.Applied Materials, Inc.Micron Technology, Inc.Fraunhofer-Gesellschaft eVShin-Etsu Chemical Co., Ltd.TOPPAN Holdings, Inc.Guangzhou Bosma Optoelectronic Technology Co. Ltd.