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Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.LG Electronics, Inc.International Business Machines Corp.Fujitsu Ltd.Sharp Corp.Ricoh Co., Ltd.Ricoh Co., Ltd.Seiko Epson Corp.SANYO Electric Co., Ltd.Intel Corp.ZTE Corp.Apple, Inc.FUJIFILM Corp.BOE Technology Group Co., Ltd.Hewlett-Packard Development Co.Brother Industries, Ltd.Eastman Kodak Co.Boe Innovation Investment Co. Ltd.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fujifilm Business Innovation Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Xerox Holdings Corp.Semiconductor Energy Laboratory Co., Ltd.Mita Industrial Co., Ltd.Toppan, Inc.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.SANYO Electric Co., Ltd.FUJIFILM Corp.Eastman Kodak Co.Nikon Corp.Taiwan Semiconductor Manufacturing Co., Ltd.Casio Computer Co., Ltd.Olympus Corp.Japan Display, Inc.Mitsubishi Cable Industries Ltd.Nihon Dempa Kogyo Co., Ltd.Primax Electronics Ltd.Canon Marketing Japan, Inc.Kodak Pathe SASLARGAN Precision Co., Ltd.Hongfujin Precision Industry (Wuhan) Co., Ltd.Mabuchi Motor Co., Ltd.Olympus Imaging Corp.Altek Corp.Ricoh Imaging Co., Ltd.Xacti Corp.Qisda (Suzhou) Co. Ltd.Tonen Chemical Corp.Qisda (Suzhou) Co. Ltd.Ability Opto-Electronics Technology Co., Ltd.AT & S Austria Technologie & Systemtechnik AGShipley Co. LLCSANYO Semiconductor Co., Ltd.
OppoAAC Acoustic Technologies (Shenzhen) Co., Ltd.Shure, Inc.MtekVision Co., Ltd.Ritek Corp.AKG Acoustics GmbHYa Horng Electronic Co., Ltd.Mobile Abwicklungsgesellschaft GmbH & Co. oHGAlcor Micro Corp.Beken Corp.Archos SABeats Electronics LLCSzbroad Technology Co. Ltd.Dreamus Co.Alereon, Inc.Digital Networks North America, Inc.Digital Networks North America, Inc.beyerdynamic GmbH & Co. KGJBL GmbH & Co. KGGreen Hills Software, Inc.Sony (China) Ltd.jWIN Electronics Corp.Cornice, Inc.dreamGEAR LLCSiPort, Inc.Brodit ABTsinghua Unigroup Co., Ltd.Cyber Acoustics LLCRhapsodymGine Corp.
Taiwan Semiconductor Manufacturing Co., Ltd.Shin-Etsu Chemical Co., Ltd.Shin-Etsu Handotai Co., Ltd.Angang Steel Co., Ltd.Shin-Etsu Polymer Co., Ltd.Wuhan Iron & Steel Co., Ltd.Soitec SAWuhan Iron & Steel Group Corp.Fujimi, Inc.Elpida Memory, Inc.Siltronic AGPrimetals Technologies Austria GmbHElkem ASAElectro Scientific Industries, Inc.Silicon Laboratories, Inc.AIXTRON SENippon Steel & Sumikin Coated Sheet Corp.Inner Mongolia Baotou Steel Union Co. Ltd.Hirata Corp.LX Semicon Co., Ltd.GlobalWafers Co., Ltd.eMemory Technology, Inc.Silicon Integrated Systems Corp.Silicon Integrated Systems Corp.Faraday Technology Corp.Fujian Longking Co., Ltd.OSAKA Titanium Technologies Co., Ltd.GigaLane Co., Ltd.Anshan Iron & Steel Group Corp.Fujikoshi Machinery Corp.
Boe Innovation Investment Co. Ltd.Advanced Micro Devices, Inc.Chi Mei Optoelectronics Corp.Wistron Corp.Acer, Inc.Lenovo (Singapore) Pte Ltd.Digital Equipment Corp.Compal Electronics, Inc.Symbol Technologies, Inc.Pegatron Corp.Peking University Founder Group Corp.Peking University Founder Group Corp.Elecom Co., Ltd.Tonen Chemical Corp.Amotech Co., Ltd.Shenzhen Sunway Communication Co., Ltd.Lite-On IT Corp.Shenzhen Sunway Communication Co., Ltd.Belkin International, Inc.Ability Opto-Electronics Technology Co., Ltd.Control Data Corp.Suzhou Fuqiang Technology Co. Ltd.ACCO Brands Corp.Fujian Nebula Electronics Co., Ltd.Guangzhou Kingsons Leather Products Co. Ltd.Century Technology (Shenzhen) Co., Ltd.Dataproducts CorpShuttle, Inc.Wenger Manufacturing, Inc.Jiangsu Favored Nanotechnology Co., Ltd.
3M Innovative Properties Co.Eastman Kodak Co.Motorola, Inc.Kyoraku Sangyo KKYeda Research & Development Co. Ltd.Worldwide Specialty Property Services Pty Ltd.Worldwide Specialty Property Services Pty Ltd.Mastercard International, Inc.Yissum Research Development Co. Ltd.Purdue Research FoundationPalo Alto Research Center, Inc.Ampex Corp.Disney Enterprises, Inc.IP2IPO Innovations Ltd.Ramot at Tel Aviv University Ltd.Konkuk University Industry-Academic Cooperation FoundationImagination Technologies Ltd.Intellectual Discovery Co., Ltd.Energy Conversion Devices, Inc.Appotronics Corp. Ltd.Mosaid Technologies, Inc.UCL Business Ltd.International Engine Intellectual Property Co. LLCInternational Truck Intellectual Property Co. LLCDigimarc Corp.Ansaldo Energia IP UK Ltd.Conversant Wireless Licensing SARLLongitude Licensing Ltd.Tecpharma Licensing AGMasimo Corp.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Toppan, Inc.Fraunhofer-Gesellschaft eVSamsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.