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Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Toppan, Inc.Fraunhofer-Gesellschaft eVSamsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Resonac Corp.
Giantec Semiconductor Corp.Wuxi ETEK Microelectronics Co., Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Resonac Corp.Sumitomo Metal Industries Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.TCL China Star Optoelectronics Technology Co., Ltd.
PixArt Imaging, Inc.Rockchip Electronics Co., Ltd.Genesis Microchip, Inc.Tokyo Electron Device Ltd.GEO Semiconductor, Inc.Oak Technology, Inc.Beijing Triolion Science & Technology Co., Ltd.Veridify Security, Inc.Blaize, Inc.Thinklogical LLCAbaco Systems Ltd.Kinashi Denki Seisakusho KKGlenbrook Technologies, Inc.
Rivulet Communications, Inc.Melrok LLC
Oki Electric Industry Co., Ltd.Hamamatsu Photonics KKNidec Sankyo Corp.Minolta Co., Ltd.CKD Corp.Panasonic Industrial Devices SUNX Co., Ltd.Panasonic Industrial Devices SUNX Co., Ltd.Morpho, Inc.Leuze electronic GmbH + Co. KGNireco Corp.Pixar Animation Studios, Inc.Shenzhen Launch Digital Technology Co., Ltd.Intsig Information Co., Ltd.POLYTEC GmbHFyusion, Inc.Photon-X, Inc.Shashin Kagaku Co., Ltd.Beijing Daheng Image Vision Co., Ltd.Beijing Daheng Image Vision Co., Ltd.Digital Endoscopy GmbHNikon-Trimble Co. Ltd.Dasung Tech Co. Ltd.ADTEX, Inc.ISRA VISION AG /Old/Dac Engineering Co. Ltd.Camtek Imaging Technology (Suzhou) Co. Ltd.Xiroku, Inc.Nanjing Res Inst of Surv, Map & Geotech Investig, Co., Ltd.Nestor, Inc.GEOSAT Aerospace & Technology, Inc.
Taiwan Semiconductor Manufacturing Co., Ltd.Shin-Etsu Chemical Co., Ltd.Shin-Etsu Handotai Co., Ltd.Angang Steel Co., Ltd.Wuhan Iron & Steel Co., Ltd.Soitec SAWuhan Iron & Steel Group Corp.Fujimi, Inc.Elpida Memory, Inc.Siltronic AGPrimetals Technologies Austria GmbHElkem ASAElectro Scientific Industries, Inc.AIXTRON SENippon Steel & Sumikin Coated Sheet Corp.Inner Mongolia Baotou Steel Union Co. Ltd.Hirata Corp.LX Semicon Co., Ltd.CSG Holding Co., Ltd.GlobalWafers Co., Ltd.eMemory Technology, Inc.Silicon Integrated Systems Corp.Silicon Integrated Systems Corp.Faraday Technology Corp.OSAKA Titanium Technologies Co., Ltd.GigaLane Co., Ltd.Anshan Iron & Steel Group Corp.Fujikoshi Machinery Corp.Tongwei Co., Ltd.Institut National des Sciences Appliquées de Lyon