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Samsung Electronics Co., Ltd.LG Electronics, Inc.General Electric Co.Sharp Corp.Seiko Epson Corp.SANYO Electric Co., Ltd.E.I. du Pont de Nemours & Co.EIDP, Inc.Intel Corp.Sumitomo Electric Industries Ltd.Apple, Inc.Brother Industries, Ltd.KYOCERA Chemical Corp.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Toshiba Chemical Corp.Kyocera Corp.Fujifilm Business Innovation Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Daewoo Electronics Co. Ltd.DAIKIN INDUSTRIES Ltd.Honeywell International, Inc.Kobe Steel, Ltd.Casio Computer Co., Ltd.Midea Group Co. Ltd.Electronics & Telecommunications Research Institute
Raytheon Co.Nokia Siemens Networks OyTokin Corp. /JP/National University of Defense TechnologyNational University of Defense TechnologyAsahi Kasei Microdevices Corp.Guangdong Galanz Enterprises Co., Ltd.Nisshinbo Micro Devices, Inc.Leica Geosystems AGLeica Geosystems AGL3Harris Technologies ASA Ltd.Roke Manor Research Ltd.Israel Aerospace Industries Ltd.Keysight Technologies, Inc.MCI, Inc.MCI, Inc.USG Interiors LLCAselsan Elektronik Sanayi ve Ticaret ASMACOM Technology Solutions Holdings, Inc.Vaisala OyjSun Create Electronics Co., Ltd.WM Motor Technology Co., Ltd.Rheinmetall Air Defence AGShanghai Hesai Technology Co., LtdGuangzhou Haige Communications Group Inc. Co.Guangzhou Haige Communications Group Inc. Co.Toshiba Hokuto Electronics Corp.TeleNav, Inc.Shenzhen Silver Basis Technology Co., Ltd.Beijing Rigol Electronic Co. Ltd.