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ZTE Corp.Motorola, Inc.KDDI Corp.Ericsson, Inc.CommScope Technologies LLCAnritsu Corp.Quanta Computer, Inc.Telecom Italia SpATamura Corp.Hyundai WIA Corp.Viavi Solutions, Inc.Wistron NeWeb Corp.Sagemcom Broadband SASSagemcom Broadband SASScientific-Atlanta, Inc.Anhui Tatfook Technology Co., Ltd.Extreme Networks, Inc.Askey Computer Corp.HemphillNokia of America Corp.Maxar Space LLCFaraday Technology Corp.China Academy of Information & Communication TechnologyJMA LLCECI Telecom Ltd.ALAXALA Networks Corp.SOLiD, Inc.Suzhou Centec Communications Co., Ltd.KT Freetel Co., Ltd.ADTRAN, Inc.
Koninklijke Philips NVKoninklijke Philips NVFUJIFILM Corp.Nikon Corp.OppoElectronics & Telecommunications Research InstituteFraunhofer-Gesellschaft eVKonica Minolta, Inc.Industrial Technology Research InstituteHuazhong University of Science & TechnologyMinolta Co., Ltd.Hitachi Cable Ltd.Funai Electric Co., Ltd.University of Electronic Science & Technology of ChinaBeihang UniversityBeijing University of TechnologyBeijing Institute of TechnologySouthwest Jiaotong UniversityHarbin University of Science & TechnologyNational University of Defense TechnologyMax Planck Gesellschaft zur Förderung der Wissenschaften eVSCHOTT AGCalifornia Institute of TechnologyNanjing UniversityFujinon, Inc.National University of Defense TechnologyNanjing University of Posts & TelecommunicationsNanjing University of Information Science & TechnologyBeijing University of Posts & TelecommunicationsDeutsches Zentrum für Luft- und Raumfahrt e.V.
Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.Toray Industries, Inc.Teijin Ltd.Toyobo Co., Ltd.Hitachi Cable Ltd.Eastman Chemical Co.IBIDEN Co., Ltd.Unitika Ltd.Zhejiang Sci-Tech UniversityChina Telecom Corp. Ltd.Chisso Corp.SWCC Corp.kabelmetal electro GmbHNisshinbo Textile Inc.Valmet Corp.Xi'an Polytechnic UniversityNikkiso Co., Ltd.Lenzing AGTrützschler GmbH & Co. KGLG Information & Communications Ltd.KCC Corp.Nichiha Corp.Beijing New Building Materials Public Ltd. Co.Campagnolo SRLMERCURY Corp.Rosenberger Hochfrequenztechnik GmbH & Co. KGGE Lighting Solutions LLCHeraeus Quarzglas GmbH & Co. KGGE Lighting Solutions LLC
NOF Corp.Toray Advanced Film Co., Ltd.UltraTech International, Inc.NEI Corp.P2i Ltd.Picosun OyHemoteq AGEuroplasma NVHzO, Inc.EPG (Engineered nanoProducts Germany) AGMolecular Rebar Design LLCKoninklijke BAM Groep NVModumetal, Inc.Semblant Ltd.Innventia ABGSI Creos Corp.Cambrios Technologies Corp.Future Carbon GmbHTiotech ASCellutech ABnGimat Co.Applied Thin Films, Inc.Eikos, Inc.SupraPolix BVMelodea Ltd.Lotus Applied Technology LLCBactiguard ABOceanit Laboratories, Inc.Carbodeon Ltd. OyRust-Oleum Corp.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.Hon Hai Precision Industry Co., Ltd.Samsung Display Co., Ltd.SK hynix, Inc.BOE Technology Group Co., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Boe Innovation Investment Co. Ltd.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.LG Display Co., Ltd.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Oki Electric Industry Co., Ltd.Applied Materials, Inc.Micron Technology, Inc.Fraunhofer-Gesellschaft eVShin-Etsu Chemical Co., Ltd.TOPPAN Holdings, Inc.Guangzhou Bosma Optoelectronic Technology Co. Ltd.
LG Electronics, Inc.Sharp Corp.Nippon Telegraph & Telephone Corp.ZTE Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Kyocera Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Oki Electric Industry Co., Ltd.Electronics & Telecommunications Research InstituteMotorola, Inc.NTT DOCOMO, Inc.Alcatel-Lucent S AShowa Denko Materials Co. Ltd.Western Electric Co., Inc.vivo Mobile Communication Co., Ltd.Resonac Corp.Fujikura Ltd.Hitachi Metals, Ltd.Nokia Siemens Networks OyChina Mobile Communications Group Co., Ltd.Lucent Technologies, Inc.China Mobile Communications Group Co., Ltd.Mannesmann AGJapan Aviation Electronics Industry Ltd.SK Telecom Co., Ltd.BlackBerry Ltd.Orange SAChina United Network Communications Group Co., Ltd.Huawei Device Co., Ltd.China Telecom Corp. Ltd.
BOE Technology Group Co., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Boe Innovation Investment Co. Ltd.LG Display Co., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Renesas Electronics Corp.Lam Research Corp.United Microelectronics Corp.Nichia Corp.JUKI Corp.Macronix International Co., Ltd.Socionext, Inc.Shin-Etsu Handotai Co., Ltd.Shinko Electric Industries Co., Ltd.Institute of Microelectronics of Chinese Academy of SciencesShinko Electric Industries Co., Ltd.National Semiconductor Corp.Institute of Microelectronics of Chinese Academy of SciencesSkyworks Solutions, Inc.DB HITEK Co., Ltd.Advanced Semiconductor Engineering, Inc.Altera Corp.Chunghwa Picture Tubes Ltd.Novatek Microelectronics Corp.Soitec SAEnplas Corp.Toshiba Electronic Devices & Storage Corp.HRL Laboratories LLCShenzhen Royole Technologies Co., Ltd.Shenzhen Royole Technologies Co., Ltd.
