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Samsung Electronics Co., Ltd.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Toppan, Inc.Fraunhofer-Gesellschaft eVSamsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.South China University of Technology
Lite-On IT Corp.Access Co., Ltd.DEXIN Corp.Trek 2000 International Ltd.Cirque Corp.Sercomm Corp.Canaan Creative Co., Ltd.Innodisk Corp.Hyperstone GmbHADTEX Inc.Axiohm SASIvani LLCLattice Energy Technology Corp.Tera SRLActions Semiconductor Co. Ltd.Magnum Semiconductor, Inc.WFE Technology Corp.Bandspeed, Inc.Dukosi Ltd.Imperas, Inc.Cypak ABSAND Technology, Inc.Future Dial, Inc.Kudelski SAZimplistic Pvt Ltd.MCCI Corp.CANDY HOUSE, Inc.Abalta Technologies, Inc.CEYX Technologies, Inc.Grass Wonder, Inc.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Resonac Corp.Sumitomo Metal Industries Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.
Beyond Innovation Technology Co. Ltd.Shanghai Longjing Technology Co., Ltd.Shanghai Longjing Technology Co., Ltd.Davicom Semiconductor, Inc.Terawins, Inc.Amphion Semiconductor Ltd.VBrick Systems, Inc.Cheng Fwa Industrial Co., Ltd.
Imedia Corp.Zapex Technologies, Inc.
PixArt Imaging, Inc.Rockchip Electronics Co., Ltd.Genesis Microchip, Inc.Tokyo Electron Device Ltd.GEO Semiconductor, Inc.Applied Brain Research, Inc.Beijing Triolion Science & Technology Co., Ltd.Hailo Technologies Ltd.Veridify Security, Inc.Blaize, Inc.Thinklogical LLCAbaco Systems Ltd.Nethra Imaging, Inc.Glenbrook Technologies, Inc.Kinashi Denki Seisakusho KK
Canon, Inc.Canon, Inc.Sony Group Corp.International Business Machines Corp.Fujitsu Ltd.General Electric Co.General Electric Co.Huawei Technologies Co., Ltd.Seiko Epson Corp.Intel Corp.ZTE Corp.Apple, Inc.FUJIFILM Corp.Hewlett-Packard Development Co.Eastman Kodak Co.Fujifilm Business Innovation Corp.Google LLCFujifilm Business Innovation Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Honeywell International, Inc.Xerox Holdings Corp.Tencent Technology (Shenzhen) Co., Ltd.Alcatel-Lucent S AOlympus Corp.Microsoft Corp.Beijing Xiaomi Mobile Software Co., Ltd.Toyota Industries Corp.Muratec Automation Co., Ltd.Victor Company of Japan Ltd.Victor Company of Japan Ltd.