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Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.LG Electronics, Inc.Fujitsu Ltd.Sharp Corp.Ricoh Co., Ltd.Seiko Epson Corp.SANYO Electric Co., Ltd.Intel Corp.FUJIFILM Corp.Apple, Inc.ZTE Corp.Hon Hai Precision Industry Co., Ltd.Samsung Display Co., Ltd.SK hynix, Inc.BOE Technology Group Co., Ltd.Hewlett-Packard Development Co.Brother Industries, Ltd.Eastman Kodak Co.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Boe Innovation Investment Co. Ltd.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.LG Display Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Xerox Holdings Corp.Oki Electric Industry Co., Ltd.Olympus Corp.
Samsung Electronics Co., Ltd.LG Electronics, Inc.General Electric Co.General Electric Co.Sharp Corp.Seiko Epson Corp.SANYO Electric Co., Ltd.E.I. du Pont de Nemours & Co.Intel Corp.Sumitomo Electric Industries Ltd.Apple, Inc.Sumitomo Electric Industries Ltd.Hon Hai Precision Industry Co., Ltd.SK hynix, Inc.Brother Industries, Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Toshiba Chemical Corp.Fuji Electronics Co., Ltd.LG Display Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Daewoo Electronics Co. Ltd.DAIKIN INDUSTRIES Ltd.Honeywell International, Inc.Kobe Steel, Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Hon Hai Precision Industry Co., Ltd.Samsung Display Co., Ltd.SK hynix, Inc.BOE Technology Group Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.LG Display Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Oki Electric Industry Co., Ltd.Micron Technology, Inc.Shin-Etsu Chemical Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Showa Denko Materials Co. Ltd.Resonac Corp.STMicroelectronics SASumitomo Metal Industries Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.Hon Hai Precision Industry Co., Ltd.Samsung Display Co., Ltd.SK hynix, Inc.BOE Technology Group Co., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Boe Innovation Investment Co. Ltd.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.LG Display Co., Ltd.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Oki Electric Industry Co., Ltd.Applied Materials, Inc.Micron Technology, Inc.Fraunhofer-Gesellschaft eVShin-Etsu Chemical Co., Ltd.TOPPAN Holdings, Inc.Guangzhou Bosma Optoelectronic Technology Co. Ltd.
Alps Alpine Co., Ltd.OSRAM Opto Semiconductors GmbHKeihin Corp.Conti Temic Microelectronic GmbHTamagawa Seiki Co., Ltd.Watlow Electric Manufacturing Co.The Toro Co.Preh GmbHPepperl+Fuchs, Inc.Methode Electronics, Inc.BorgWarner Ludwigsburg GmbHInterface, Inc.Casco Products Corp.FIGARO Engineering, Inc.Nippon Ceramic Co., Ltd.Tactual Labs Co.Balluff, Inc.Hanwei Electronics Group Corp.PolyIC GmbH & Co. KGTokico System Solutions Ltd.Therm-O-Disc, Inc.ISORG SACyberOptics Corp.IDEX Biometrics ASAElmos Semiconductor SENippon Aleph Corp.Nova Biomedical Corp.Ibeo Automotive Systems GmbHAutonics Corp.Electricfil Automotive SAS
Sharp Corp.SK hynix, Inc.Alps Alpine Co., Ltd.Hamamatsu Photonics KKSony Semiconductor Solutions Corp.OSRAM Opto Semiconductors GmbHShenzhen Goodix Technology Co., Ltd.Keihin Corp.Novatek Microelectronics Corp.PixArt Imaging, Inc.Tamagawa Seiki Co., Ltd.STMicroelectronics International NVDraeger Safety, Inc.Watlow Electric Manufacturing Co.Preh GmbHCrucialtec Co., Ltd.Pepperl+Fuchs, Inc.Egis Technology, Inc.Methode Electronics, Inc.BorgWarner Ludwigsburg GmbHInterface, Inc.Casco Products Corp.FlexEnable Ltd.FIGARO Engineering, Inc.Nippon Ceramic Co., Ltd.Tactual Labs Co.Balluff, Inc.PolyIC GmbH & Co. KGTokico System Solutions Ltd.Therm-O-Disc, Inc.
OSRAM Opto Semiconductors GmbHFreescale Semiconductor, Inc.Harman International Industries, Inc.Keihin Corp.Nihon Dempa Kogyo Co., Ltd.Asahi Kasei Microdevices Corp.PixArt Imaging, Inc.Tamagawa Seiki Co., Ltd.Yamato-Scale Co., Ltd.CTS Corp.Roche Diabetes Care GmbHDraeger Safety, Inc.Watlow Electric Manufacturing Co.Analogic Corp.Preh GmbHPepperl+Fuchs, Inc.Methode Electronics, Inc.Kistler Holding AGExelis, Inc.Shoei Chemical, Inc.BorgWarner Ludwigsburg GmbHSpectris PlcInterface, Inc.Casco Products Corp.FIGARO Engineering, Inc.Sensirion AGKyowa Electronic Instruments Co., Ltd.Kyowa Electronic Instruments Co., Ltd.Physik Instrumente (PI) GmbH & Co. KGNippon Ceramic Co., Ltd.
