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Samsung Electronics Co., Ltd.Canon, Inc.International Business Machines Corp.Fujitsu Ltd.General Electric Co.Huawei Technologies Co., Ltd.Seiko Epson Corp.SANYO Electric Co., Ltd.Intel Corp.ZTE Corp.Apple, Inc.FUJIFILM Corp.Hewlett-Packard Development Co.Eastman Kodak Co.Fujifilm Business Innovation Corp.Google LLCFujifilm Business Innovation Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Honeywell International, Inc.Xerox Holdings Corp.Tencent Technology (Shenzhen) Co., Ltd.Alcatel-Lucent S AOlympus Corp.Microsoft Corp.Beijing Xiaomi Mobile Software Co., Ltd.Toyota Industries Corp.Muratec Automation Co., Ltd.Victor Company of Japan Ltd.Victor Company of Japan Ltd.
International Business Machines Corp.Fujitsu Ltd.Eastman Kodak Co.Google LLCMicrosoft Corp.Beijing Xiaomi Mobile Software Co., Ltd.Beijing Xiaomi Mobile Software Co., Ltd.Baidu Online Network Technology (Beijing) Co., Ltd.BlackBerry Ltd.Deutsche Telekom AGDeutsche Telekom AGGemalto, Inc.Sega Group Corp.Beijing Jingdong Shangke Information Technology Co., Ltd.Beijing Jingdong Shangke Information Technology Co., Ltd.Orion Co., Ltd.LEGO A/SLEGO A/SCitrix Systems, Inc.NetEase (Hangzhou) Network Co., Ltd.Altera Corp.SK Planet Co., Ltd.Avaya, Inc.HGST, Inc.Heroku, Inc.Alcatel-Lucent Shanghai Bell Co., Ltd.Sandvik AktiebolagOlivetti SpASaudi Basic Industries Corp.CA Technologies, Inc.
Samsung Electronics Co., Ltd.Canon, Inc.LG Electronics, Inc.International Business Machines Corp.Fujitsu Ltd.Sharp Corp.Ricoh Co., Ltd.Ricoh Co., Ltd.Seiko Epson Corp.SANYO Electric Co., Ltd.Intel Corp.ZTE Corp.Apple, Inc.FUJIFILM Corp.BOE Technology Group Co., Ltd.Hewlett-Packard Development Co.Brother Industries, Ltd.Eastman Kodak Co.Boe Innovation Investment Co. Ltd.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fujifilm Business Innovation Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Xerox Holdings Corp.Semiconductor Energy Laboratory Co., Ltd.Mita Industrial Co., Ltd.Toppan, Inc.Konica Minolta, Inc.
Hitachi Ltd.LG Electronics, Inc.Toyota Motor Corp.International Business Machines Corp.Fujitsu Ltd.General Electric Co.Huawei Technologies Co., Ltd.Ericsson, Inc.Intel Corp.ZTE Corp.Apple, Inc.Boe Innovation Investment Co. Ltd.Google LLCHoneywell International, Inc.Xerox Holdings Corp.Bayerische Motoren Werke AGAlcatel-Lucent S ANTT DOCOMO, Inc.Renesas Electronics Corp.Dow Global Technologies LLCMicrosoft Corp.Toshiba Lighting & Technology Corp.Toyoda Gosei Co., Ltd.Toshiba Lighting & Technology Corp.Hilti AGMediaTek, Inc.Aisin AW Co., Ltd.Boston Scientific Scimed, Inc.Advanced Micro Devices, Inc.Otis Elevator Co.
Xerox Holdings Corp.Graco, Inc.Zoox, Inc.Tokyo Kikai Seisakusho, Ltd.Yodogawa Steel Works, Ltd.Scheidt & Bachmann GmbHNippon Filcon Co., Ltd.SKIDATA AGCCCC First Highway Consultants Co., Ltd.China Road & Bridge Corp.China Road & Bridge Corp.Argo AI LLCEast Nippon Expressway Co. Ltd.CCCC Highway Consultants Co., Ltd.Uisee Technologies (Beijing) Ltd.DeepRoute.ai Co., Ltd.Neology, Inc.Pony.ai, Inc.Zongmu Technology (Shanghai) Co. Ltd.IHI Construction Materials Co., Ltd.Zongmu Technology (Shanghai) Co. Ltd.INRIX, Inc.Wuhan Engineering Co. Ltd. of CrsgOn Track Innovations Ltd.Vivozon Pharmaceutical Co., Ltd.Park24 Co., Ltd.Tosei Corp.China Minsheng Banking Corp., Ltd.ParkingCloud Co., Ltd.Chery Jaguar Land Rover Automotive Co., Ltd.
Wasteless Ltd.Scientific Revenue, Inc.cFares, Inc.
Hitachi Ltd.Vaisala OyjHero MotoCorp Ltd.Guangdong Topstar Technology Co., Ltd.IMAX Corp.Enevate Corp.NovAtel, Inc.Discovery, Inc.Harex InfoTech, Inc.24M Technologies, Inc.SoundHound, Inc.Zwipe ASOxis Energy Ltd.James Cook UniversityLive Nation Entertainment, Inc.Faradion Ltd.Nantenergy, Inc.Skorpios Technologies, Inc.SmarDTV SAQuintel Technology Ltd.University of Rey Juan CarlosAmbri, Inc.Elex AGIonic Materials, Inc.Marsulex Environmental Technologies Corp.AccuWeather, Inc.Histide AGCentrica Hive Ltd.HiSilicon Technologies Co., Ltd.Earth Networks, Inc.