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Samsung Electronics Co., Ltd.Micron Technology, Inc.MagnaChip Semiconductor Ltd.DB HITEK Co., Ltd.Gentex Corp.Huaian Imaging Device Manufacturer Corp.Huaian Imaging Device Manufacturer Corp.Unity Opto Technology Co., Ltd.Rockley Photonics Ltd.IHP GmbH - Innovations for High Performance MicroelectronicsInvensas Bonding Technologies, Inc.National Chi Nan UniversityFoveon, Inc.MOBOTIX AGAvnera Corp.Tung Thih Electronic Co., Ltd.Skorpios Technologies, Inc.Lightmatter, Inc.Brigates Microelectronics Inc.Tower Semiconductor Ltd.Pixelplus Co., Ltd.Akustica, Inc.AmberWave Systems Corp.MEMSIC, Inc.Silicon Optronics, Inc.New Imaging Technologies SAXiroku, Inc.DecaWave Ltd.Luxtera, Inc.Tensorcom, Inc.
Hangzhou H3C Technologies Co., Ltd.Adobe, Inc.Lexmark International, Inc.Comcast Cable Communications LLCNagravision SABritish Broadcasting Corp.Canon IT Solutions, Inc.Level 3 Communications LLCGoPro, Inc.L3Harris Technologies ASA Ltd.Wangsu Science & Technology Co., Ltd.Wangsu Science & Technology Co., Ltd.Digimarc Corp.Irdeto BVNetflix, Inc.Oath, Inc.Paramount GlobalCapcom Co., Ltd.Roku, Inc.Akamai Technologies, Inc.Intertrust Technologies Corp.JustSystems Corp.NCsoft Corp.DIRECTV LLCViaccess SAGracenote, Inc.V-Nova International Ltd.Hulu LLCTiVo Corp.DivX LLC
Mitutoyo Corp.KLA Corp.FARO Technologies, Inc.Zygo Corp.OPTiM Corp.Smiths Detection-Watford Ltd.3Shape A/S3Shape A/SLiebherr-Aerospace Lindenberg GmbHPTC, Inc.Dassault Systemes Simulia Corp.Anritsu Infivis Co., Ltd.Bentley Systems, Inc.Magnaflux Corp.Photon Dynamics, Inc.UNISON Co., Ltd.FORCE TechnologyShantou Institute of Ultrasonic Instruments Co. Ltd.K LASER Technology, Inc.Shantou Institute of Ultrasonic Instruments Co. Ltd.Foshan Shunde Everteam Industrial Co. Ltd.Amann Girrbach AGPerceptron, Inc.Magnetic Analysis Corp.Proceq SAInstitut Dr. Foerster GmbH & Co. KGPaR Systems, Inc.Team, Inc.Spectronics Corp.QSA Global, Inc.
Toshiba Research Europe Ltd.Fundació Institut de Ciencies FotoniquesPsiQuantum Corp.Photon Dynamics, Inc.Precision Biosensor, Inc.Guangzhou Hexin Instrument Co., Ltd.Guangzhou Hexin Instrument Co., Ltd.Photoelectron Corp.Xiant Technologies, Inc.Zyvex Labs LLCPhoton Control, Inc.PHOTONIS Netherlands BVPrinceton Lightwave, Inc.MirraViz, Inc.Sensus Healthcare, Inc.Beijing Chaoweijing Biotechnology Co. Ltd.Upstream Engineering OyUpstream Engineering OyPhotek Ltd.Crop Microclimate Management, Inc.micro-AMS, Inc.3D at Depth, Inc.Solasta, Inc.Hydro-Photon, Inc.Photon Kinetics, Inc.Compact Particle Acceleration Corp.Synergetics USA, Inc.
Samsung Electronics Co., Ltd.LG Electronics, Inc.General Electric Co.General Electric Co.Sharp Corp.Seiko Epson Corp.SANYO Electric Co., Ltd.E.I. du Pont de Nemours & Co.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.Apple, Inc.Brother Industries, Ltd.KYOCERA Chemical Corp.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Toshiba Chemical Corp.Fujifilm Business Innovation Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Daewoo Electronics Co. Ltd.DAIKIN INDUSTRIES Ltd.Honeywell International, Inc.Nitto Electric Industrial Co. Ltd.Kobe Steel, Ltd.Casio Computer Co., Ltd.