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Hitachi Plant Technologies Ltd.Electric Power Research Institute, Inc.Takasago Thermal Engineering Co., Ltd.Geco TechnologiesAmetech, Inc.BASF Catalysts LLCFEV Motorentechnik GmbH & Co. KGKatayama Chemical, Inc.Fameccanica Data SpABeijing GeoEnviron Engineering & Technology, Inc.Beijing GeoEnviron Engineering & Technology, Inc.Trojan Technologies, Inc.Ormat Technologies, Inc.Tokamak Energy Ltd.FITT SpAZhejiang Feida Environmental Science & Technology Co., Ltd.Beijing Sanju Environmental Protection & New Materials Co Ltd.Zöller-Kipper GmbHBeijing Haixin Energy Technology Co., Ltd.Guangxi Bossco Environmental Protection Technology Co., Ltd.Dunmow Skips Ltd.Xingyuan Environment Technology Co., Ltd.Shanghai Kanghuan Environment Co. Ltd.Beijing SPC Environment Protection Tech Co., Ltd.Der Grüne Punkt - Duales System Deutschland GmbHPorvair PlcBeijing SPC Environment Protection Tech Co., Ltd.NIT Co., Ltd.Tetra Tech, Inc.Shenwu Environmental Technology Co., Ltd.
Boe Innovation Investment Co. Ltd.Honeywell International, Inc.TDK Corp.Thales GroupAlps Alpine Co., Ltd.Niterra Co., Ltd.Thales SAHamamatsu Photonics KKGoodrich Corp.Japan Aviation Electronics Industry Ltd.OSRAM Opto Semiconductors GmbHNippon Seiki Co., Ltd.Freescale Semiconductor, Inc.HELLA GmbH & Co. KGaARTX Corp.LAPIS Semiconductor Co. Ltd.DePuy Synthes Products, Inc.Microchip Technology, Inc.Nabtesco Corp.The Georgia Tech Research Corp.TDK Electronics AGParker-Hannifin Corp.Shenzhen Goodix Technology Co., Ltd.Furuno Electric Co., Ltd.Novatek Microelectronics Corp.Conti Temic Microelectronic GmbHTextron, Inc.Asahi Kasei Microdevices Corp.Meizu Technology Co. Ltd.PixArt Imaging, Inc.
Alps Alpine Co., Ltd.Niterra Co., Ltd.Freescale Semiconductor, Inc.Broadcom Corp.Keihin Corp.Conti Temic Microelectronic GmbHAsahi Kasei Microdevices Corp.PixArt Imaging, Inc.Tamagawa Seiki Co., Ltd.Safran SACTS Corp.Allegro MicroSystems LLCPacific Industrial Co., Ltd.Trimble Navigation Ltd.Draeger Safety, Inc.Watlow Electric Manufacturing Co.Preh GmbHOPTEX Co. Ltd.Kistler Holding AGPepperl+Fuchs, Inc.Methode Electronics, Inc.Sensirion AGSitronix Technology Corp.Casco Products Corp.Interface, Inc.Shenzhen Hangsheng Electronics Co., Ltd.Balluff, Inc.Nippon Ceramic Co., Ltd.Moving Magnet Technologies SANavinfo Co., Ltd.
LAPIS Semiconductor Co. Ltd.Synaptics, Inc.Jabil, Inc.ams-OSRAM Asia Pacific Pte Ltd.Melfas, Inc.Cross Match Technologies, Inc.HuantekH.P.B. Optoelectronics Co. Ltd.Oblong Industries, Inc.Hillcrest Laboratories, Inc.Sony Depthsensing Solutions SA/NVQuickLogic Corp.ArcSoft, Inc.Cipia Vision Ltd.Ultraleap Ltd.Standing Egg, Inc.Crunchfish ABPhotonic Sensors & Algorithms SLPhotonic Sensors & Algorithms SLNanocomp Oy Ltd.Hangzhou Aixin Intelligent Technology Co., Ltd.Hangzhou Aixin Intelligent Technology Co., Ltd.iProov Ltd.XYZ Interactive Technologies, Inc.gestigon GmbHApollo Optical Systems, Inc.Hangzhou Faceunity Technology Co. Ltd.PrimeSense Ltd.Ineda Systems, Inc.Super Node Innovation Technology Shenzhen Co. Ltd.
Fujitsu Ltd.Harbin Institute of TechnologyMastercard International, Inc.Giesecke+Devrient GmbHShenzhen Goodix Technology Co., Ltd.Shenzhen Goodix Technology Co., Ltd.PayPal, Inc.Huf Hülsbeck & Fürst GmbH & Co. KGFujitsu Frontech Ltd.National Taiwan UniversitySharkNinja Operating LLCInstitute For Information IndustryNational Cheng Kung UniversityIflytek Co., Ltd.Academia SinicaSynaptics, Inc.National Chiao Tung UniversitySafran SANational Taiwan University of Science & TechnologyX Corp. (United States)National Central UniversityU-Shin, Ltd.National Central UniversityThe Chamberlain Group, Inc.Beijing Minglue Software System Ltd.Beijing Minglue Software System Ltd.National Pingtung University of Science & TechnologyEgis Technology, Inc.Industrial Bank of KoreaBruin Biometrics LLC
Samsung Electronics Co., Ltd.SK hynix, Inc.OppoMicron Technology, Inc.Samsung Electro-Mechanics Co., Ltd.Hamamatsu Photonics KKSony Semiconductor Solutions Corp.United Microelectronics Corp.MagnaChip Semiconductor Ltd.DB HITEK Co., Ltd.Cypress Semiconductor Corp.LARGAN Precision Co., Ltd.PixArt Imaging, Inc.STMicroelectronics International NVNovuton Technology Corp. JapanSarnoff Corp.IEE International Electronics & Engineering SASony Group Corp.FUJIFILM Electronic Materials USA, Inc.Huaian Imaging Device Manufacturer Corp.Huaian Imaging Device Manufacturer Corp.VisEra Technologies Co., Ltd.Corephotonics Ltd.FlexEnable Ltd.PolyIC GmbH & Co. KGTeledyne Scientific & Imaging LLCISORG SAInvensas Bonding Technologies, Inc.SEKONIX Co., Ltd.AGC Techno Glass Co. Ltd.
Samsung Electronics Co., Ltd.SK hynix, Inc.Advanced Micro Devices, Inc.KIOXIA Corp.Seagate Technology LLCWestern Digital Technologies, Inc.Macronix International Co., Ltd.Winbond Electronics Corp.Yangtze Memory Technologies Co., Ltd.Lite-On Technology Corp.Canon Anelva Corp.Elecom Co., Ltd.Phison Electronics Corp.Dawning Information Industry Co., Ltd.ADATA Technology Co., Ltd.Zalman Tech Co., Ltd.Quanta Storage, Inc.Shenzhen Sunlord Electronics Co., Ltd.Nantero, Inc.Hunan Goke Microelectronics Co., Ltd.Xiamen Hongfa Electroacoustic Co., Ltd.IEI Integration Corp.Beijing Memblaze Technology Co. Ltd.Beijing Memblaze Technology Co. Ltd.Adesto Technologies Corp.Transcend Information, Inc.Cross Match Technologies, Inc.Floadia Corp.Viking Tech Corp.Viking Technology, Inc.
