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Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Oki Electric Industry Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Micron Technology, Inc.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Toppan, Inc.Fraunhofer-Gesellschaft eVSamsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.
Canon Anelva Corp.Honda Tsushin Kogyo Co., Ltd.FORCE TechnologyPlasma-Therm LLCCentre Testing International Group Co., Ltd.Altis Semiconductor SNCAltis Semiconductor SNCMott Corp.Centre Testing International Group Co., Ltd.United Memories, Inc.Touchstone Research Laboratory Ltd.Quantum Global Technologies LLCEDAX LLCYXLON International X-Ray GmbHRJ Lee Group, Inc.COMET Holding AGNeocera LLCNorner ASMaterials Analysis Technology, Inc.Plastronics Socket Co., Inc.New Wave Research, Inc.TESCAN ORSAY HOLDING ASOptonics, Inc.Fibics, Inc.Integrated Service Technology, Inc.Exponent, Inc.Teseda Corp.scia Systems GmbHNikon X-Tek Systems Ltd.Suisse Technology Partners AG