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Maipu Communication Technology Co., Ltd.Maipu Communication Technology Co., Ltd.Intertrust Technologies Corp.Itron Networked Solutions, Inc.Dialogic Corp.Dialogic Corp.Grandstream Networks, Inc.Real-Time Innovations, Inc.WIDCOMM, Inc.Ant Software Ltd.eMotive Communications, Inc.Incognito Software Systems, Inc.Myrio Corp.Xybridge Technologies, Inc.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Sony Group Corp.International Business Machines Corp.Fujitsu Ltd.General Electric Co.General Electric Co.Huawei Technologies Co., Ltd.Seiko Epson Corp.SANYO Electric Co., Ltd.ZTE Corp.Apple, Inc.FUJIFILM Corp.Hewlett-Packard Development Co.Eastman Kodak Co.Fujifilm Business Innovation Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Honeywell International, Inc.Xerox Holdings Corp.Oki Electric Industry Co., Ltd.Tencent Technology (Shenzhen) Co., Ltd.Alcatel-Lucent S AOlympus Corp.Microsoft Corp.Beijing Xiaomi Mobile Software Co., Ltd.Toyota Industries Corp.Muratec Automation Co., Ltd.Victor Company of Japan Ltd.Victor Company of Japan Ltd.
RingCentral, Inc.Gigaset Communications GmbHAlpha Networks, Inc.8x8, Inc.silex technology, Inc.Twilio, Inc.TranSwitch Corp.ShoreTel, Inc.Calix, Inc.Alvarion Ltd.Audiocodes, Inc.Centillium Communications, Inc.Grandstream Networks, Inc.BroadSoft, Inc.Ooma, Inc.Net2Phone, Inc.Nextiva, Inc.Acme Packet, Inc.Phoenix Technologies International LLCJAJAH, Inc.World Wide Packets, Inc.Nurivoice Co., Ltd.PowerDsine Ltd.NextNet Wireless, Inc.IntelePeer, Inc.Talari Networks, Inc.D2 Technologies, Inc.Harbour Networks Holdings Ltd.Eyeball Networks, Inc.Cellcrypt Ltd.
Samsung Electronics Co., Ltd.Sony Group Corp.LG Electronics, Inc.General Electric Co.General Electric Co.Sharp Corp.Seiko Epson Corp.SANYO Electric Co., Ltd.E.I. du Pont de Nemours & Co.EIDP, Inc.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.Apple, Inc.Brother Industries, Ltd.KYOCERA Chemical Corp.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Toshiba Chemical Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Daewoo Electronics Co. Ltd.DAIKIN INDUSTRIES Ltd.Honeywell International, Inc.Nitto Electric Industrial Co. Ltd.Kobe Steel, Ltd.Midea Group Co. Ltd.Mita Industrial Co., Ltd.
Canon, Inc.Canon, Inc.Fujitsu Ltd.Sharp Corp.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Resonac Corp.Sumitomo Metal Industries Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.TCL China Star Optoelectronics Technology Co., Ltd.NXP Semiconductors (Thailand) Co., Ltd.NGK SPARK PLUG CO., LTD.NXP BV
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Oki Electric Industry Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Micron Technology, Inc.Toppan, Inc.Fraunhofer-Gesellschaft eVAGC, Inc. (Japan)ABB Automation, Inc.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.