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Samsung Electronics Co., Ltd.LG Electronics, Inc.General Electric Co.Sharp Corp.Seiko Epson Corp.SANYO Electric Co., Ltd.E.I. du Pont de Nemours & Co.EIDP, Inc.Intel Corp.Sumitomo Electric Industries Ltd.Apple, Inc.Brother Industries, Ltd.KYOCERA Chemical Corp.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Toshiba Chemical Corp.Fujifilm Business Innovation Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Daewoo Electronics Co. Ltd.DAIKIN INDUSTRIES Ltd.Honeywell International, Inc.Nitto Electric Industrial Co. Ltd.Kobe Steel, Ltd.Casio Computer Co., Ltd.Midea Group Co. Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.LG Electronics, Inc.International Business Machines Corp.Fujitsu Ltd.Sharp Corp.Ricoh Co., Ltd.Ricoh Co., Ltd.Seiko Epson Corp.SANYO Electric Co., Ltd.Intel Corp.ZTE Corp.Apple, Inc.FUJIFILM Corp.BOE Technology Group Co., Ltd.Hewlett-Packard Development Co.Brother Industries, Ltd.Eastman Kodak Co.Boe Innovation Investment Co. Ltd.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fujifilm Business Innovation Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Xerox Holdings Corp.Semiconductor Energy Laboratory Co., Ltd.Mita Industrial Co., Ltd.Toppan, Inc.Konica Minolta, Inc.
National Semiconductor Corp.Atmel Corp.AVIC Jonhon Optronic Technology Co., Ltd.AVIC Jonhon Optronic Technology Co., Ltd.Qorvo US, Inc.Novuton Technology Corp. JapanSilicon Storage Technology, Inc.KMW, Inc.Anhui Tatfook Technology Co., Ltd.Nations Technologies, Inc.Tongyu Communication, Inc.Tongding Interconnection Information Co., Ltd.MaxLinear, Inc.GigaLane Co., Ltd.PARTRON Co., Ltd.DEXIN Corp.RichWave Technology Corp.E-TEN Information Systems Co., Ltd.INPAQ Technology Co., Ltd.NEW POWER PLASMA Co., Ltd.RF360 Europe GmbHParkerVision, Inc.EZconn Corp.Wuhan Fingu Electronic Technology Co., Ltd.Jiangsu Hengxin Technology Co., Ltd.Officine di Cartigliano SpAWuhan Fingu Electronic Technology Co., Ltd.Jiangsu Hengxin Technology Co., Ltd.ISCO International, Inc.Nanjing Changfeng Aerospace Electronics Technology Co. Ltd.
Wuhan Fingu Electronic Technology Co., Ltd.Wuhan Fingu Electronic Technology Co., Ltd.Guangdong Shenglu Telecommunication Tech Co., Ltd.Guangdong Shenglu Telecommunication Tech Co., Ltd.Suzhou RF Top Electronic Communications Co., Ltd.DeTect, Inc.Suzhou RF Top Electronic Communications Co., Ltd.Bird Technologies Group, Inc.Tai-Saw Technology Co., Ltd.BenQ Medical Technology Corp.K&L Microwave, Inc.Blighter Surveillance Systems Ltd.Terma A/S
LSI Corp.Colder Products Co.Paul Mueller Co.Peratech Holdco Ltd.Si-Ware SystemsYasa Ltd.Special Devices, Inc.Switchcraft, Inc.iC-Haus GmbHLeviatZetex PlcElma Electronic, Inc.Pillarhouse International Ltd.Marvell Hispania SLPressol - Schmiergeräte GmbHSTAHL CraneSystems GmbHIMST GmbHVascoMed GmbHHittite Microwave Corp.AnTech Ltd.INSYS MICROELECTRONICS GmbHPowernet Oymicrofluidic ChipShop GmbHLitronik Batterietechnologie GmbHGuildline Instruments Ltd.Poundfield Products Ltd.Anaren, Inc.TAS Energy, Inc.Accent SpARBC CBS Coastal Bearing Services LLC
Huawei Technologies Co., Ltd.Ericsson, Inc.Intel Corp.Nippon Telegraph & Telephone Corp.ZTE Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.NTT DOCOMO, Inc.vivo Mobile Communication Co., Ltd.Nokia Siemens Networks OyMediaTek, Inc.China Mobile Communications Group Co., Ltd.China Mobile Communications Group Co., Ltd.SZ DJI Technology Co., Ltd.telent Ltd.Mannesmann AGSK Telecom Co., Ltd.BlackBerry Ltd.Xiaomi Corp.Motorola Solutions, Inc.Nubia Technology Co., Ltd.KDDI Corp.China United Network Communications Ltd.Beijing University of Posts & TelecommunicationsMotorola Solutions Credit Co. LLCGuangzhou Shiyuan Electronic Technology Co. Ltd.Guangzhou Shiyuan Electronic Technology Co. Ltd.Deutsche Telekom AGHangzhou H3C Technologies Co., Ltd.China Telecom Corp. Ltd.
BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Renesas Electronics Corp.LG Display Co., Ltd.Lam Research Corp.Toyota Central R&D Labs, Inc.Chi Mei Optoelectronics Corp.Nichia Corp.Semiconductor Components Industries LLCJUKI Corp.Socionext, Inc.Macronix International Co., Ltd.Shin-Etsu Handotai Co., Ltd.Shinko Electric Industries Co., Ltd.National Semiconductor Corp.Institute of Microelectronics of Chinese Academy of SciencesDB HITEK Co., Ltd.Advanced Semiconductor Engineering, Inc.Skyworks Solutions, Inc.Altera Corp.Chunghwa Picture Tubes Ltd.Nanya Technology Corp.Soitec SANovatek Microelectronics Corp.Citizen Electronics (China) Co., Ltd.Shenzhen Royole Technologies Co., Ltd.HRL Laboratories LLCRound Rock Research LLC
