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Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Toppan, Inc.Fraunhofer-Gesellschaft eVSamsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Resonac Corp.
Ericsson, Inc.Intel Corp.Nippon Telegraph & Telephone Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Casio Computer Co., Ltd.Fraunhofer-Gesellschaft eVAlcatel-Lucent S ANTT DOCOMO, Inc.South China University of Technologyvivo Mobile Communication Co., Ltd.University of Electronic Science & Technology of ChinaMediaTek, Inc.BT Group PlcDatang Mobile Communications Equipment Co. Ltd.SK Telecom Co., Ltd.China Jiliang UniversityMotorola Solutions, Inc.Nubia Technology Co., Ltd.KDDI Corp.Motorola Mobility LLCDeutsche Telekom AGChina Telecom Corp. Ltd.Xilinx, Inc.Quanta Computer, Inc.Magic Leap, Inc.Juniper Networks, Inc.VMware, Inc.Skyworks Solutions, Inc.Rohde & Schwarz GmbH & Co. KG
LG Electronics, Inc.General Electric Co.Sharp Corp.Seiko Epson Corp.E.I. du Pont de Nemours & Co.EIDP, Inc.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.Apple, Inc.Brother Industries, Ltd.KYOCERA Chemical Corp.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Toshiba Chemical Corp.Kyocera Corp.Fujifilm Business Innovation Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Daewoo Electronics Co. Ltd.DAIKIN INDUSTRIES Ltd.Honeywell International, Inc.Nitto Electric Industrial Co. Ltd.Kobe Steel, Ltd.Casio Computer Co., Ltd.Midea Group Co. Ltd.Electronics & Telecommunications Research InstituteMita Industrial Co., Ltd.The Dow Chemical Co.3M Co.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Oki Electric Industry Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Micron Technology, Inc.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Resonac Corp.Sumitomo Metal Industries Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.
Samsung Electro-Mechanics Co., Ltd.Onkyo Home Entertainment Corp.Quantum SpATeikoku Tsushin Kogyo Co., Ltd.Niigata Seimitsu Co., Ltd.Hirschmann Car Communication GmbHLeader Electronics Corp.Forward Electronics Co., Ltd.Techtotop Microelectronics Technology Co., Ltd.Zoran Corp.Integrant Technologies, Inc.DIGEN Co., Ltd.Rosum Corp.HermesHoldings Corp.Rafael Microelectronics, Inc.UKOM, Inc.Allied Wheel Components, Inc.Elonics Ltd.Diamond Multimedia Systems, Inc.Mirics Ltd.Control4 Corp.Mesuro Ltd.McIntosh Laboratory, Inc.Pixela Corp.FEI-Elcom Tech, Inc.Kaben Wireless Silicon, Inc.Tsinghua Unigroup Co., Ltd.Broadlogic Network Technologies, Inc.iReady Corp.Harman Kardon, Inc.
Electronics & Telecommunications Research InstituteASML Netherlands BVHyundai MicroElectronics Co., Ltd.Institute of Microelectronics of Chinese Academy of SciencesNovatek Microelectronics Corp.Beijing NAURA Microelectronics Equipment Co., Ltd.IBM United Kingdom Ltd.JOLED, Inc.Shanghai Huali Microelectronics Corp.Shanghai Huali Microelectronics Corp.Asahi Kasei Microdevices Corp.Tianma Microelectronics Co., Ltd.Wuhan Tian Ma Microelectronics Co., Ltd.Shanghai Tianma Microelectronics Co., Ltd.Xiamen Tianma Microelectronics Co., Ltd.Xiamen Tianma Microelectronics Co., Ltd.SAES Getters SpAHeraeus Precious Metals GmbH & Co. KGElectro Scientific Industries, Inc.Sanechips Technology Co., Ltd.Makino Milling Machine Co., Ltd.Mine Safety Appliances Co. LLCNuvoton Technology Corp.MPI Corp.LX Semicon Co., Ltd.Fujitsu Microelectronics, Inc.ELAN Microelectronics Corp.InvenSense, Inc.Kateeva, Inc.Raydium Semiconductor Corp.
National Semiconductor Corp.Atmel Corp.AVIC Jonhon Optronic Technology Co., Ltd.AVIC Jonhon Optronic Technology Co., Ltd.Qorvo US, Inc.Novuton Technology Corp. JapanSilicon Storage Technology, Inc.Anhui Tatfook Technology Co., Ltd.Nations Technologies, Inc.Smiths Group PlcTongyu Communication, Inc.Tongding Interconnection Information Co., Ltd.MaxLinear, Inc.Speed Tech Corp.GigaLane Co., Ltd.PARTRON Co., Ltd.DEXIN Corp.AngioDynamics, Inc.RichWave Technology Corp.INPAQ Technology Co., Ltd.Sunwave Communications Co., Ltd.RF360 Europe GmbHAvic Forstar S&T Co., Ltd.EZconn Corp.Wuhan Fingu Electronic Technology Co., Ltd.Jiangsu Hengxin Technology Co., Ltd.Officine di Cartigliano SpAWuhan Fingu Electronic Technology Co., Ltd.Jiangsu Hengxin Technology Co., Ltd.Nanjing Changfeng Aerospace Electronics Technology Co. Ltd.
