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General Electric Co.General Electric Co.Honeywell International, Inc.The Boeing Co.Thales GroupSubaru Corp.Raytheon Co.Subaru Corp.Beihang UniversityLucas Industries PlcDaicel Corp.KYB Corp.Hughes Aircraft Co.SZ DJI Technology Co., Ltd.Japan Aviation Electronics Industry Ltd.BASF Corp.Hamilton Sundstrand Corp.AlliedSignal, Inc.Eclipse Aviation Corp.Tektronix, Inc.Deutsches Zentrum für Luft- und Raumfahrt e.V.United Aircraft Corp.Analog Devices, Inc.Mitsubishi Cable Industries Ltd.Voith GmbH & Co. KGaAMesserschmitt-Boelkow-Blohm GmbHMesserschmitt-Boelkow-Blohm GmbHNorthrop Grumman Systems Corp.Pratt & Whitney Canada Corp.Raychem Corp.
General Electric Co.General Electric Co.AlliedSignal, Inc.Woodward, Inc.ELTA Systems Ltd.BAE Systems Controls, Inc.Leonardo MW Ltd.Ball Aerospace & Technologies Corp.United Defense LPL3 Technologies, Inc.NEC Aerospace Systems Ltd.B/E Aerospace Systems GmbHBAE Systems PlcBAE Systems (Defence Systems) Ltd.GKN Westland Aerospace, Inc.Ohmega Technologies, Inc.Research Electro-Optics, Inc.ATA Engineering, Inc.Nord-Micro GmbH & Co. OHGTUSA-Türk Havacilik ve Uzay Sanayii ASBAE Systems Information Solutions, Inc.
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Zhejiang Tengen Electrics Co., Ltd.Beijing Kedong Power Control Systems Co. Ltd.Beijing Kedong Power Control Systems Co. Ltd.Powertech Industrial Co., Ltd.Shanghai Hua Hong NEC Electronics Co., Ltd.FineTek Co., Ltd.Shanghai Grand County Power Control Technology Co., Ltd.Sichuan Injet Electric Co., Ltd.Sichuan Injet Electric Co., Ltd.NF Holdings Corp.Alps Green Devices Co., Ltd.Shanghai Fuel Cell Vehicle Powertrain Co., Ltd.Jefferson Electric, Inc.Bentec GmbH Drilling & Oilfield SystemsBasler Electric Co.Data Device Corp.Spang & Co.Zhejiang Deluo Power Equipment Co., Ltd.EnSync, Inc.Hydrolux SarlApex Microtechnology, Inc.Nidec ASI SpATevva Motors (Jersey) Ltd.Interpion Semiconductor Co., Ltd.Moog Luxembourg SARLAutocell Laboratories, Inc.Lowell Manufacturing Co.Sipex Corp.Indice Semiconductor, Inc.Remosa SRL
Mine Safety Appliances Co. LLCMEMSCAP SATegal Corp.AMTROL, Inc.Silex Microsystems ABMEMSIC, Inc.Yoshitake IncM2N, Inc.SA Photonics, Inc.UCC EnvironmentalStanding Egg, Inc.Sites SrlMEMS CORE Co. Ltd.The Comfort Group, Inc.AMST Co., Ltd.EcoNova, Inc.Afore OyGrunau Co., Inc.LIGHTCONNECT, Inc.Standard MEMS, Inc.Stegia ABKeyotee, Inc.ADVENT Engineering Services, Inc.
Boe Innovation Investment Co. Ltd.Honeywell International, Inc.Thales GroupAlps Alpine Co., Ltd.Raytheon Co.NGK SPARK PLUG CO., LTD.Hamamatsu Photonics KKJapan Aviation Electronics Industry Ltd.Nippon Seiki Co., Ltd.Freescale Semiconductor, Inc.LAPIS Semiconductor Co. Ltd.Analog Devices, Inc.DePuy Synthes Products, Inc.Rosemount, Inc.Dr. Johannes Heidenhain GmbHThe Georgia Tech Research Corp.Shenzhen Goodix Technology Co., Ltd.Shenzhen Goodix Technology Co., Ltd.Furuno Electric Co., Ltd.Novatek Microelectronics Corp.Textron, Inc.Asahi Kasei Microdevices Corp.Meizu Technology Co. Ltd.Tamagawa Seiki Co., Ltd.KEYENCE Corp.Weidmüller Interface GmbH & Co. KGFerranti Ltd.Piaggio & C SpAB/E Aerospace, Inc.Piaggio & C SpA
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.International Business Machines Corp.Fujitsu Ltd.General Electric Co.General Electric Co.Huawei Technologies Co., Ltd.Seiko Epson Corp.SANYO Electric Co., Ltd.ZTE Corp.Apple, Inc.FUJIFILM Corp.Hewlett-Packard Development Co.Eastman Kodak Co.Fujifilm Business Innovation Corp.Fujifilm Business Innovation Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Honeywell International, Inc.Xerox Holdings Corp.Tencent Technology (Shenzhen) Co., Ltd.Alcatel-Lucent S AMicrosoft Corp.Beijing Xiaomi Mobile Software Co., Ltd.Toyota Industries Corp.Muratec Automation Co., Ltd.Victor Company of Japan Ltd.Victor Company of Japan Ltd.Beijing Xiaomi Mobile Software Co., Ltd.
